发明申请
US20110031610A1 SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE 有权
半导体器件,半导体器件制造方法,印刷电路板和电子器件

SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE
摘要:
Provided is a semiconductor device including a flexible circuit board which includes a first external electrode provided on a first face and second and third external electrodes provided on a second face; a plurality of memory devices and passive components; a supporter which is provided with a groove on one face; and a computing processor device. The memory devices and the passive components are connected to the first external electrode, the one face of the supporter is bonded on the first face of the flexible circuit board so that the groove houses the memory devices and the passive components. The flexible circuit board is bent along a perimeter of the supporter to be wrapped around a side face and another face of the supporter. On the flexible circuit board, the second external electrode is provided on the second face which is opposite to the first external electrode, and the third external electrode is provided on the second face which is bent to the another face of the supporter. The computing processor device is connected to the second external electrode, and a bump is formed on the third external electrode.
公开/授权文献
信息查询
0/0