发明申请
- 专利标题: SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE
- 专利标题(中): 半导体器件,半导体器件制造方法,印刷电路板和电子器件
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申请号: US12920265申请日: 2009-03-26
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公开(公告)号: US20110031610A1公开(公告)日: 2011-02-10
- 发明人: Takao Yamazaki , Shinji Watababe , Shizuaki Masuda , Katsuhiko Suzuki
- 申请人: Takao Yamazaki , Shinji Watababe , Shizuaki Masuda , Katsuhiko Suzuki
- 申请人地址: JP Tokyo JP Shizuoka
- 专利权人: NEC CORPORATION,NEC ACCESSTECHNICA, LTD.
- 当前专利权人: NEC CORPORATION,NEC ACCESSTECHNICA, LTD.
- 当前专利权人地址: JP Tokyo JP Shizuoka
- 优先权: JP2008-087138 20080328
- 国际申请: PCT/JP2009/056851 WO 20090326
- 主分类号: H01L23/498
- IPC分类号: H01L23/498 ; H01L21/60
摘要:
Provided is a semiconductor device including a flexible circuit board which includes a first external electrode provided on a first face and second and third external electrodes provided on a second face; a plurality of memory devices and passive components; a supporter which is provided with a groove on one face; and a computing processor device. The memory devices and the passive components are connected to the first external electrode, the one face of the supporter is bonded on the first face of the flexible circuit board so that the groove houses the memory devices and the passive components. The flexible circuit board is bent along a perimeter of the supporter to be wrapped around a side face and another face of the supporter. On the flexible circuit board, the second external electrode is provided on the second face which is opposite to the first external electrode, and the third external electrode is provided on the second face which is bent to the another face of the supporter. The computing processor device is connected to the second external electrode, and a bump is formed on the third external electrode.
公开/授权文献
- US08338940B2 Semiconductor device 公开/授权日:2012-12-25
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