发明申请
- 专利标题: POWER MODULE AND CIRCUIT BOARD ASSEMBLY THEREOF
- 专利标题(中): 电源模块和电路板组件
-
申请号: US12851237申请日: 2010-08-05
-
公开(公告)号: US20110032683A1公开(公告)日: 2011-02-10
- 发明人: Han Li , Gang Liu , Jing Chen , Jinfa Zhang
- 申请人: Han Li , Gang Liu , Jing Chen , Jinfa Zhang
- 申请人地址: TW Taoyuan Hsien
- 专利权人: DELTA ELECTRONICS, INC.
- 当前专利权人: DELTA ELECTRONICS, INC.
- 当前专利权人地址: TW Taoyuan Hsien
- 优先权: TW098126685 20090806
- 主分类号: H05K7/02
- IPC分类号: H05K7/02
摘要:
A power module includes a first bobbin, a primary winding coil, a circuit board assembly and a first magnetic core assembly. The primary winding coil is wound around the first bobbin. The circuit board assembly includes a printed circuit board, a second winding structure, at least one current-sensing element, a rectifier circuit and an electrical connector. The second winding structure has an output terminal. The current-sensing element includes a first conductor. The first conductor is a conductive sheet. A first end of the first conductor is in contact with the output terminal of the second winding structure. A second end of the first conductor is connected to the rectifier circuit. The primary winding coil is aligned with the second winding structure of the circuit board assembly and arranged within the first magnetic core assembly. The primary winding coil and the electrical connector are electrically connected with a system board.
公开/授权文献
- US08373533B2 Power module and circuit board assembly thereof 公开/授权日:2013-02-12
信息查询