Disclosed is a resin-metal bonded article which is improved in adhesion between a copper component and a PPS or PBT resin. Also disclosed is a method for producing such a resin-metal bonded article. The resin-metal bonded article is obtained by bonding the resin component onto the surface of the copper component through a copper component bonding surface where there is copper oxide in the following range: 10%≦Cu2O/(Cu2O+CuO)≦75%. Preferably, this resin-metal bonded article further contains a triazine thiol derivative in the resin-component-side bonding surface of the copper component.