发明申请
- 专利标题： Manufacturing Method for Integrating a Shunt Resistor into a Semiconductor Package
- 专利标题（中）： 将并联电阻集成到半导体封装中的制造方法
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申请号： US12910933申请日： 2010-10-25
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公开(公告)号： US20110033985A1公开(公告)日： 2011-02-10
- 发明人: Ubol Udompanyavit , Sreenivasan K. Koduri , Gerald W. Steele , Jason Marc Cole , Steven Kummerl
- 申请人： Ubol Udompanyavit , Sreenivasan K. Koduri , Gerald W. Steele , Jason Marc Cole , Steven Kummerl
- 申请人地址： US TX Dallas
- 专利权人： TEXAS INSTRUMENTS INCORPORATED
- 当前专利权人： TEXAS INSTRUMENTS INCORPORATED
- 当前专利权人地址： US TX Dallas
- 主分类号： H01L21/60
- IPC分类号： H01L21/60
摘要：
An integrated circuit package that comprises a lead frame, an integrated circuit located on the lead frame and a shunt resistor coupled to the lead frame and to the integrated circuit. The shunt resistor has a lower temperature coefficient of resistance than the lead frame, and the lead frame has a lower resistivity than the shunt resistor. The shunt resistor has a low-resistance coupling to external leads of the lead frame, or, the shunt resistor has its own integrated external leads.
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