Invention Application
- Patent Title: THERMOELECTRIC DEVICE
- Patent Title (中): 热电装置
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Application No.: US12539683Application Date: 2009-08-12
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Publication No.: US20110036384A1Publication Date: 2011-02-17
- Inventor: Slade R. Culp
- Applicant: Slade R. Culp
- Main IPC: H01L35/34
- IPC: H01L35/34 ; H01L35/30
Abstract:
A thermoelectric device uses two semiconductor materials, joined together. Each of the semiconductor materials is connected to a heat source, and the combined device creates a thermoelectric effect. At least one of the semiconductor materials is modified to improve the efficiency of the thermoelectric device.
Information query
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