Invention Application
- Patent Title: MAGNETRON SPUTTERING DEVICE
- Patent Title (中): MAGNETRON喷射装置
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Application No.: US12649464Application Date: 2009-12-30
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Publication No.: US20110036708A1Publication Date: 2011-02-17
- Inventor: CHIA-YING WU , CHING-CHOU CHANG
- Applicant: CHIA-YING WU , CHING-CHOU CHANG
- Applicant Address: TW Tu-Cheng
- Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: TW Tu-Cheng
- Priority: CN200910305620.5 20090814
- Main IPC: C23C14/35
- IPC: C23C14/35 ; C23C14/58 ; C23C14/50
Abstract:
An exemplary magnetron sputtering device includes a target, a magnet arrangement, and a driving system. The target defines a magnet-receiving space therein. The magnet arrangement is received within the magnet-receiving space. The driving system is configured for driving the magnet arrangement to spin and move back and forth.
Information query
IPC分类:
