Invention Application
- Patent Title: Process for Producing a Hole Using Different Laser Positions
- Patent Title (中): 使用不同激光位置生产孔的工艺
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Application No.: US12855090Application Date: 2010-08-12
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Publication No.: US20110036819A1Publication Date: 2011-02-17
- Inventor: Jan Münzer , Thomas Podgorski
- Applicant: Jan Münzer , Thomas Podgorski
- Priority: EP09010546.1 20090817
- Main IPC: B23K26/00
- IPC: B23K26/00
Abstract:
Methods for producing a continuous hole in a substrate are provided. A laser is used for producing an inner proportion and a diffuser of the continuous hole, wherein an angular position of the laser with respect to the substrate is changed at least three times.
Public/Granted literature
- US09040871B2 Process for producing a hole using different laser positions Public/Granted day:2015-05-26
Information query
