发明申请
- 专利标题： SEMICONDUCTOR PACKAGE
- 专利标题（中）： 半导体封装
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申请号： US12848057申请日： 2010-07-30
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公开(公告)号： US20110037179A1公开(公告)日： 2011-02-17
- 发明人: Paresh Limaye , Jan Vanfleteren , Eric Beyne
- 申请人： Paresh Limaye , Jan Vanfleteren , Eric Beyne
- 申请人地址： BE Leuven BE Leuven BE Gent
- 专利权人： IMEC,Katholieke Universiteit Leuven,UNIVERSITEIT GENT
- 当前专利权人： IMEC,Katholieke Universiteit Leuven,UNIVERSITEIT GENT
- 当前专利权人地址： BE Leuven BE Leuven BE Gent
- 主分类号： H01L23/52
- IPC分类号： H01L23/52 ; H01L21/60
摘要：
A semiconductor package is disclosed. In one aspect, the package includes a base frame and a wiring substrate mounted on the base frame. The base frame has two pieces made of a material with respectively a first and a second coefficient of thermal expansion and connected to each other via resilient connecting structures. The wiring substrate has electric wiring tracks providing the electric connection between first and second bond pads, provided for being electrically connected to bond pads on respectively a die and a printed wiring board. The electrical wiring tracks have flexible parts provided to expand and contract along with the resilient connecting structures.
公开/授权文献
- US08450825B2 Semiconductor package 公开/授权日：2013-05-28
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