Invention Application
- Patent Title: SUBSTRATE INCLUDING AN ESD PROTECTION FUNCTION
- Patent Title (中): 基板包括ESD保护功能
-
Application No.: US12915119Application Date: 2010-10-29
-
Publication No.: US20110038088A1Publication Date: 2011-02-17
- Inventor: Takashi NOMA , Jun URAKAWA
- Applicant: Takashi NOMA , Jun URAKAWA
- Applicant Address: JP Nagaokakyo-shi
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaokakyo-shi
- Priority: JP2008-122801 20080508
- Main IPC: H02H7/20
- IPC: H02H7/20

Abstract:
A substrate including an ESD protection function includes an insulating substrate, at least one of circuit elements or a wiring pattern and an ESD protection portion. In the ESD protection portion, facing portions of at least one pair of discharge electrodes are disposed in a cavity provided in the insulating substrate so that the ends face each other. The discharge electrodes are electrically connected to the circuit elements and or the wiring pattern.
Public/Granted literature
- US08693157B2 Substrate including an ESD protection function Public/Granted day:2014-04-08
Information query
IPC分类: