Abstract:
A substrate including an ESD protection function includes an insulating substrate, at least one of circuit elements or a wiring pattern and an ESD protection portion. In the ESD protection portion, facing portions of at least one pair of discharge electrodes are disposed in a cavity provided in the insulating substrate so that the ends face each other. The discharge electrodes are electrically connected to the circuit elements and or the wiring pattern.
Abstract:
To provide a ceramic composition not only having little compositional variation after burning, but a high flexural strength of the sintered body, and a high Q value in a microwave band, a ceramic composition used for forming a ceramic layer of a multi-layer ceramic substrate contains 47.0 to 67.0 wt. % of SiO2, 21.0 to 41.0 wt. % of BaO, and 10.0 to 18.0 wt. % of Al2O3, and contains as a first additive, 1.0 to 5.0 parts by weight of CeO2, relative to a total of 100 parts of SiO2, BaO and Al2O3, and as a second additive, 2.5 to 5.5 parts by weight of MnO, relative to a total of 100 parts by weight of SiO2, BaO, Al2O3 and CeO2, and is substantially free of Cr. As a third additive, at least one of Zr, Ti, Zn, Nb, Mg and Fe, and as a fourth additive, a Co component and/or a V component, may be contained.
Abstract translation:为了提供陶瓷组合物,其不仅在燃烧后具有很小的组成变化,而且烧结体的高弯曲强度和微波带中的高Q值,用于形成多层陶瓷基板的陶瓷层的陶瓷组合物 含有47.0〜67.0重量% %的SiO 2,21.0〜41.0重量% %的BaO和10.0〜18.0wt。 %的Al 2 O 3,并且作为第一添加剂含有1.0至5.0重量份的CeO 2,相对于总计为100重量份的SiO 2,BaO和Al 2 O 3,作为第二添加剂,2.5至5.5重量份的MnO相对 至100重量份的SiO 2,BaO,Al 2 O 3和CeO 2,并且基本上不含Cr。 作为第三添加剂,可以包含Zr,Ti,Zn,Nb,Mg和Fe中的至少一种,以及作为第四添加剂的Co成分和/或V成分。
Abstract:
An electrically conductive paste used for forming wiring conductors, such as via holes disposed on a multilayer ceramic substrate, is provided, wherein the temperature range, in which sintering is effected in a firing step can be controlled relatively optimally. The electrically conductive paste contains a metal powder, a glass frit, and an organic vehicle. An inorganic component, which is not sintered at a sintering temperature capable of sintering the ceramic layers (included in the multilayer ceramic substrate in the firing step, is disposed on particle surfaces of the metal powder. The glass frit has a softening point 150° C. to 300° C. lower than the above-described sintering temperature.
Abstract:
A dielectric ceramic composition includes about 10% to about 40% by weight of BaO, about 20% to about 65% by weight of SiO2, about 6% to about 40% by weight of Al2O3, about 1% to about 15% by weight of B2O3, about 0.3% to about 3% by weight of Cr2O3, and about 1% to about 40% by weight of ZrO2. A multilayer ceramic substrate has a laminated structure including an inner layer portion and outer layer portions that have a smaller thermal expansion coefficient than that of the inner layer portion. The use of the dielectric ceramic composition for the outer layer portions enables the ceramic to be resistant to erosion caused by a plating liquid used for plating external conductive films, thus maintaining good adhesiveness between the external conductive films and the outer layer portions.
Abstract translation:介电陶瓷组合物包括约10重量%至约40重量%的BaO,约20重量%至约65重量%的SiO 2,约6重量%至约40重量%的Al 2 O 3,约1重量%至约15重量% 的B 2 O 3,约0.3%至约3%的Cr 2 O 3,和约1%至约40%的ZrO 2。 多层陶瓷基板具有包括具有比内层部分的热膨胀系数小的内层部分和外层部分的层压结构。 通过使用电介质陶瓷组合物作为外层部分,陶瓷能够抵抗由用于镀覆外部导电膜的电镀液引起的侵蚀,从而保持外部导电膜与外层部分之间良好的粘接性。
Abstract:
A glass ceramic composition is used for a multilayer ceramic substrate 2 including glass ceramic layers 3 laminated, the multilayer ceramic substrate 2 being used for a multilayer ceramic module 1. The glass ceramic composition includes a first ceramic powder mainly composed of forsterite, a second ceramic powder mainly composed of at least one component selected from CaTiO3, SrTiO3 and TiO2, and a borosilicate glass powder containing Li2O, MgO, B2O3, SiO2, ZnO and Al2O3. The glass ceramic composition contains 3 percent by weight or more of the borosilicate glass powder and further contains at least one additive selected from the group consisting of CaO, BaO and SrO.
Abstract translation:玻璃陶瓷组合物用于层叠玻璃陶瓷层3的多层陶瓷基板2,多层陶瓷基板2用于多层陶瓷模块1.玻璃陶瓷组合物包括主要由镁橄榄石组成的第一陶瓷粉末,第二陶瓷 主要由选自CaTiO 3 3,SrTiO 3和TiO 2的至少一种组分的粉末和含有Li 2 O 3的硼硅酸盐玻璃粉末, 2 O,MgO,B 2 O 3,SiO 2,ZnO和Al 2 O 3 SUB>。 玻璃陶瓷组合物含有3重量%以上的硼硅酸盐玻璃粉末,还含有选自CaO,BaO和SrO中的至少一种添加剂。
Abstract:
A glass ceramic composition for glass ceramic layers laminated in multilayer ceramic substrate included in multilayer ceramic module is provided. The glass ceramic composition contains a first ceramic powder mainly composed of forsterite, a second ceramic powder mainly composed of at least one material selected from CaTiO3, SrTiO3 and TiO2, and a borosilicate glass powder containing Li2O, MgO, B2O3, SiO2, ZnO and possibly Al2O3. The content of the borosilicate glass powder is about 3 percent by weight or more. The borosilicate glass powder further contains at least one additive selected from the group consisting of CaO, BaO and SrO.
Abstract translation:提供了层叠在多层陶瓷模块中的多层陶瓷基板中的玻璃陶瓷层用玻璃陶瓷组合物。 玻璃陶瓷组合物含有主要由镁橄榄石组成的第一陶瓷粉末,主要由选自CaTiO 3 Sr 3 O 3和TiO 2的至少一种材料的第二陶瓷粉末 > 2 <! - SIPO - >和含有Li 2 O,MgO,B 2 O 3,SiO 2的硼硅酸盐玻璃粉末 ZnO和可能的Al 2 O 3 3。 硼硅酸盐玻璃粉末的含量为约3重量%以上。 硼硅酸盐玻璃粉末还含有至少一种选自CaO,BaO和SrO的添加剂。
Abstract:
An ESD protection device is manufactured such that its ESD characteristics are easily adjusted and stabilized. The ESD protection device includes an insulating substrate, a cavity provided in the insulating substrate, at least one pair of discharge electrodes each including an exposed portion that is exposed in the cavity, and external electrodes provided on a surface of the insulating substrate and connected to the discharge electrodes. Supporting electrodes obtained by dispersing conductive powder in an insulating material defining the insulating substrate are provided along a bottom surface and a top surface that define the cavity between the exposed portions of the at least one pair of discharge electrodes.
Abstract:
An ESD protection device includes a ceramic multilayer substrate, at least one pair of discharge electrodes provided in the ceramic multilayer substrate and facing each other with a space formed therebetween, external electrodes provided on a surface of the ceramic multilayer substrate and connected to the discharge electrodes. The ESD protection device includes a supporting electrode obtained by dispersing a metal material and a semiconductor material and being arranged in a region that connects the pair of discharge electrodes to each other.
Abstract:
An ESD protection device has a structure that allows ESD characteristics to be easily adjusted and stabilized. The ESD protection device includes a ceramic multilayer substrate, at least a pair of discharge electrodes located in the ceramic multilayer substrate and facing each other with a space disposed therebetween, and external electrodes located on a surface of the ceramic multilayer substrate and connected to the discharge electrodes. The ESD protection device includes a supporting electrode disposed in a region that connects the pair of discharge electrodes. The supporting electrode is made of a conductive material coated with an inorganic material having no conductivity.
Abstract:
An ESD protection device is manufactured such that its ESD characteristics are easily adjusted and stabilized. The ESD protection device includes an insulating substrate, a cavity provided in the insulating substrate, at least one pair of discharge electrodes each including an exposed portion that is exposed in the cavity, and external electrodes provided on a surface of the insulating substrate and connected to the discharge electrodes. Supporting electrodes obtained by dispersing conductive powder in an insulating material defining the insulating substrate are provided along a bottom surface and a top surface that define the cavity between the exposed portions of the at least one pair of discharge electrodes.