发明申请
- 专利标题: POLYMER REMOVING APPARATUS AND METHOD
- 专利标题(中): 聚合物去除装置和方法
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申请号: US12857938申请日: 2010-08-17
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公开(公告)号: US20110041874A1公开(公告)日: 2011-02-24
- 发明人: Takehiro Shindou , Masaki Kondo
- 申请人: Takehiro Shindou , Masaki Kondo
- 申请人地址: JP Tokyo
- 专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人地址: JP Tokyo
- 优先权: JP2009-189105 20090818
- 主分类号: B08B7/00
- IPC分类号: B08B7/00 ; B23K26/16
摘要:
A polymer removing apparatus for use in removing polymer annularly adhered to a peripheral portion of a target substrate includes a processing chamber for accommodating the target substrate having the polymer annularly adhered to the peripheral portion thereof; a mounting table for mounting the target substrate thereon; and a laser irradiation unit for irradiating ring-shaped laser light at once to the whole polymer annularly adhered to the target substrate. The polymer removing apparatus further includes an ozone gas supply unit for supplying an ozone gas to the polymer annularly adhered to the target substrate and a gas exhaust unit for exhausting the ozone gas.
公开/授权文献
- US08506718B2 Polymer removing apparatus and method 公开/授权日:2013-08-13
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