发明申请
- 专利标题： SOLDER JOINT STRUCTURE, AND JOINING METHOD OF THE SAME
- 专利标题（中）： 焊接接头结构及其接合方法
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申请号： US12935381申请日： 2010-04-27
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公开(公告)号： US20110042817A1公开(公告)日： 2011-02-24
- 发明人: Akio Furusawa , Shigeaki Sakatani , Hidetoshi Kitaura , Taichi Nakamura , Takahiro Matsuo
- 申请人： Akio Furusawa , Shigeaki Sakatani , Hidetoshi Kitaura , Taichi Nakamura , Takahiro Matsuo
- 申请人地址： JP Osaka
- 专利权人： PANASONIC CORPORATION
- 当前专利权人： PANASONIC CORPORATION
- 当前专利权人地址： JP Osaka
- 优先权： JP2009-1105242009 20090430
- 国际申请： PCT/JP2010/002999 WO 20100427
- 主分类号： H01L23/532
- IPC分类号： H01L23/532 ; H01L21/60
摘要：
A layer (105) of a metal having a crystal lattice different from the crystal lattice of a joining material (106) mainly containing Bi is placed on a surface (102b) of a semiconductor device (102), and a layer (104) of an element having a positive value of heat of formation of a compound with the joining material (106) is placed between the layer (105) of the metal having the crystal lattice different from the crystal lattice of the joining material (106) and the surface (102b) of the semiconductor device (102), thereby preventing the component of the layer (105) of the metal having the crystal lattice different from the crystal lattice of the joining material (106) from being diffused in the semiconductor device (102).
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