公开(公告)号：US20110284278A1

公开(公告)日：2011-11-24

申请号：US13110136

申请日：2011-05-18

申请人： Kiyohiro Hine ,  Shigeaki Sakatani ,  Akio Furusawa

发明人： Kiyohiro Hine ,  Shigeaki Sakatani ,  Akio Furusawa

IPC分类号： H05K1/18

CPC分类号： H05K1/111 ,  H05K3/3442 ,  H05K3/3484 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09663 ,  H05K2201/09745 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

摘要： A mounting structure includes an insulating substrate having a substrate electrode on which at least one electrode notch is provided and a resist, an electronic component having an electronic component electrode to be electrically connected to the substrate electrode, and solder paste printed on a surface of the substrate electrode. The substrate electrode has a following relation, 0

摘要翻译： 安装结构包括绝缘基板，其具有设置有至少一个电极切口的基板电极和抗蚀剂，具有电连接到基板电极的电子部件电极的电子部件和印刷在基板电极的表面上的焊膏 基板电极。 基板电极具有以下关系：0

公开(公告)号：US20090236036A1

公开(公告)日：2009-09-24

申请号：US12306610

申请日：2007-06-22

申请人： Hidenori Miyakawa ,  Ryou Kuwabara ,  Shigeaki Sakatani ,  Atsushi Yamaguchi ,  Susumu Saitoh ,  Arata Kishi

发明人： Hidenori Miyakawa ,  Ryou Kuwabara ,  Shigeaki Sakatani ,  Atsushi Yamaguchi ,  Susumu Saitoh ,  Arata Kishi

IPC分类号： B32B38/10 ,  C08L63/00 ,  B32B38/00 ,  B23K31/02

CPC分类号： H05K3/305 ,  C08G59/66 ,  C08G59/686 ,  C08K9/04 ,  C08L63/00 ,  H05K3/225 ,  H05K3/306 ,  H05K2201/0209 ,  H05K2203/1105 ,  H05K2203/176 ,  Y02P20/582 ,  Y02P70/613

摘要： A resin composition is provided that makes it possible to prevent low-heat resistant components from being damaged when heated in a process of mounting electronic components on a circuit board. There are also provided a method for easily repairing circuit boards that are determined to be off-specification products in the mounting process, and a method for separating and recovering useful circuit boards and/or electronic components from the circuit boards that are determined to be off-specification products in the mounting process. The resin composition comprises (A) 100 parts by weight of an epoxy resin, (B) 30 to 200 parts by weight of a thiol-based curing agent, (C) 5 to 200 parts by weight of an organic-inorganic composite insulating filler and (D) 0.5 to 20 parts by weight of an imidazole-based curing accelerator. According to the recovering method, the resin composition is softened by heating a part or whole of the circuit board in the mounting process, to a temperature in range not lower than the glass transition point of the resin composition and not higher than 110° C., and separating and recovering the electronic components from the circuit board.

摘要翻译： 提供了一种树脂组合物，其可以在将电子部件安装在电路板上的过程中，在加热时防止低耐热性部件被损坏。 还提供了一种容易修复在安装过程中被确定为不合规格产品的电路板的方法，以及用于从确定为关闭的电路板分离和恢复有用的电路板和/或电子部件的方法 - 在安装过程中确定产品。 树脂组合物包含（A）100重量份的环氧树脂，（B）30〜200重量份的硫醇系固化剂，（C）5〜200重量份的有机 - 无机复合绝缘填料 和（D）0.5〜20重量份的咪唑类固化促进剂。 根据回收方法，通过在安装工序中将电路板的一部分或全部加热到树脂组合物的玻璃化转变温度以上且不高于110℃的温度，使树脂组合物软化。 ，并且从电路板分离和回收电子部件。

公开(公告)号：US08810035B2

公开(公告)日：2014-08-19

申请号：US13823463

申请日：2011-10-17

申请人： Taichi Nakamura ,  Akio Furusawa ,  Shigeaki Sakatani ,  Hidetoshi Kitaura ,  Yukihiro Ishimaru

发明人： Taichi Nakamura ,  Akio Furusawa ,  Shigeaki Sakatani ,  Hidetoshi Kitaura ,  Yukihiro Ishimaru

IPC分类号： H01L23/00 ,  B23K35/26 ,  H01L21/56 ,  B23K35/30 ,  C22C5/02 ,  C22C13/00 ,  C22C5/06 ,  B23K35/02 ,  B23K1/00 ,  C22C9/00 ,  C22C1/04

CPC分类号： H01L24/30 ,  B22F2999/00 ,  B23K1/0016 ,  B23K35/0238 ,  B23K35/26 ,  B23K35/262 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K2101/40 ,  B32B15/018 ,  C22C1/0483 ,  C22C5/02 ,  C22C5/06 ,  C22C9/00 ,  C22C9/02 ,  C22C13/00 ,  H01L21/563 ,  H01L23/4827 ,  H01L23/562 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/05147 ,  H01L2224/05639 ,  H01L2224/05647 ,  H01L2224/2733 ,  H01L2224/29 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/32245 ,  H01L2224/32503 ,  H01L2224/32507 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/83065 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/8381 ,  H01L2224/83815 ,  H01L2924/00015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/00014 ,  B22F1/0003 ,  H01L2924/0105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/01028 ,  H01L2224/45099

摘要： A bonding structure body in which a semiconductor element and an electrode are bonded via a solder material, wherein a part that allows bonding has a first intermetallic compound layer that has been formed on the electrode side, a second intermetallic compound layer that has been formed on the semiconductor element side, and a third layer that is constituted by a phase containing Sn and a sticks-like intermetallic compound part, which is sandwiched between the two layers of the first intermetallic compound layer and the second intermetallic compound layer, and the sticks-like intermetallic compound part is interlayer-bonded to both of the first intermetallic compound layer and the second intermetallic compound layer.

摘要翻译： 一种接合结构体，其中半导体元件和电极通过焊料材料接合，其中允许接合的部分具有形成在电极侧的第一金属间化合物层，形成在第二金属间化合物层上的第二金属间化合物层 半导体元件侧和由夹在第一金属间化合物层和第二金属间化合物层的两层之间的含有Sn和棒状金属间化合物部分的相位构成的第三层， 类似金属间化合物部分被层间接合到第一金属间化合物层和第二金属间化合物层上。

公开(公告)号：US08552307B2

公开(公告)日：2013-10-08

申请号：US13110136

申请日：2011-05-18

申请人： Kiyohiro Hine ,  Shigeaki Sakatani ,  Akio Furusawa

发明人： Kiyohiro Hine ,  Shigeaki Sakatani ,  Akio Furusawa

IPC分类号： H05K1/18

CPC分类号： H05K1/111 ,  H05K3/3442 ,  H05K3/3484 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09663 ,  H05K2201/09745 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

摘要： A mounting structure includes an insulating substrate having a substrate electrode on which at least one electrode notch is provided and a resist, an electronic component having an electronic component electrode to be electrically connected to the substrate electrode, and solder paste printed on a surface of the substrate electrode. The substrate electrode has a following relation, 0

摘要翻译： 安装结构包括绝缘基板，其具有设置有至少一个电极切口的基板电极和抗蚀剂，具有电连接到基板电极的电子部件电极的电子部件和印刷在基板电极的表面上的焊膏 基板电极。 基板电极具有以下关系：0

公开(公告)号：US08410377B2

公开(公告)日：2013-04-02

申请号：US12260219

申请日：2008-10-29

申请人： Atsushi Yamaguchi ,  Hidenori Miyakawa ,  Shigeaki Sakatani ,  Koso Matsuno

发明人： Atsushi Yamaguchi ,  Hidenori Miyakawa ,  Shigeaki Sakatani ,  Koso Matsuno

IPC分类号： H01L23/28

CPC分类号： H05K3/3484 ,  B23K35/264 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K3/284 ,  H05K3/321 ,  H05K3/3463 ,  H01L2924/3512 ,  H01L2924/00

摘要： A plurality of semiconductor elements is adjacently mounted on a substrate by a solder with a melting point of 200° C. or lower, an electronic part other than the semiconductor elements is mounted on the substrate between the adjacently mounted semiconductor elements by a solder with a melting point of 200° C. or lower, and spaces between the plurality of semiconductor elements and the substrate, spaces between the electronic part and the substrate, and spaces between the plurality of semiconductor elements and the electronic part are integrally molded with a molding resin.

摘要翻译： 多个半导体元件通过熔点为200℃以下的焊料相邻地安装在基板上，除了半导体元件之外的电子部件通过焊料与相邻安装的半导体元件之间的基板安装在基板上 熔点为200℃以下，多个半导体元件与基板之间的空间，电子部件与基板之间的空间以及多个半导体元件与电子部件之间的空间与成形树脂一体成型 。

公开(公告)号：US08338966B2

公开(公告)日：2012-12-25

申请号：US13003024

申请日：2010-06-17

申请人： Akio Furusawa ,  Shigeaki Sakatani ,  Hidetoshi Kitaura ,  Taichi Nakamura ,  Takahiro Matsuo

发明人： Akio Furusawa ,  Shigeaki Sakatani ,  Hidetoshi Kitaura ,  Taichi Nakamura ,  Takahiro Matsuo

IPC分类号： H01L23/48

CPC分类号： C22C12/00 ,  B23K1/0016 ,  B23K1/20 ,  B23K35/264 ,  B23K35/362 ,  B23K2101/40 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29118 ,  H01L2224/29144 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83439 ,  H01L2224/838 ,  H01L2224/83805 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/00012 ,  H01L2924/01007 ,  H01L2924/01031 ,  H01L2924/01049 ,  H01L2924/01016 ,  H01L2924/01083 ,  H01L2924/01034 ,  H01L2924/3512 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention provides a semiconductor component having a joint structure including a semiconductor device, an electrode disposed opposite the semiconductor device, and a joining material which contains Bi as main component and connects the semiconductor device to the electrode. Since the joining material contains a carbon compound, joint failure due to the difference in linear expansion coefficient between the semiconductor device and the electrode can be reduced compared with conventional materials. The joining material which contains Bi as main component enables provision of a joint structure in which a semiconductor device and an electrode are joined by a joint more reliable than a conventional joint.

摘要翻译： 本发明提供一种具有接合结构的半导体部件，该接合结构包括半导体器件，与半导体器件相对设置的电极，以及包含Bi作为主要部件并将半导体器件连接到电极的接合材料。 由于接合材料含有碳化合物，与常规材料相比，可以减少由于半导体器件和电极之间的线性膨胀系数的差异引起的接合故障。 含有Bi作为主要成分的接合材料能够提供通过比常规接头更可靠的接头将半导体器件和电极接合的接合结构。

公开(公告)号：US20120153461A1

公开(公告)日：2012-06-21

申请号：US13263900

申请日：2010-07-20

申请人： Hidetoshi Kitaura ,  Akio Furusawa ,  Shigeaki Sakatani ,  Taichi Nakamura ,  Takahiro Matsuo

发明人： Hidetoshi Kitaura ,  Akio Furusawa ,  Shigeaki Sakatani ,  Taichi Nakamura ,  Takahiro Matsuo

IPC分类号： H01L23/498 ,  H01L21/60

CPC分类号： H01L24/29 ,  H01L24/27 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/27462 ,  H01L2224/27472 ,  H01L2224/2901 ,  H01L2224/29019 ,  H01L2224/29082 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29187 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83005 ,  H01L2224/83191 ,  H01L2224/83385 ,  H01L2224/838 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/10335 ,  H01L2924/10375 ,  H01L2924/10376 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2924/01014 ,  H01L2924/01007 ,  H01L2924/01031 ,  H01L2924/01049 ,  H01L2924/01016 ,  H01L2924/01083 ,  H01L2924/01034 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/27 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor component of the present invention includes a semiconductor element and a joining layer formed on one surface of the semiconductor element and consisting of a joining material containing Bi as an essential ingredient, and projecting sections are formed on a surface of the joining layer on a side opposite to a surface in contact with the semiconductor element. By joining the semiconductor component to an electrode arranged so as to face the joining layer, the generation of a void can be suppressed.

摘要翻译： 本发明的半导体元件包括半导体元件和形成在半导体元件的一个表面上并由包含Bi作为必要成分的接合材料构成的接合层，并且在接合层的表面上形成突出部分 与与半导体元件接触的表面相对。 通过将半导体部件接合到与接合层相对配置的电极，可以抑制空隙的产生。

公开(公告)号：US08138426B2

公开(公告)日：2012-03-20

申请号：US12261368

申请日：2008-10-30

申请人： Koso Matsuno ,  Hidenori Miyakawa ,  Shigeaki Sakatani

发明人： Koso Matsuno ,  Hidenori Miyakawa ,  Shigeaki Sakatani

IPC分类号： H05K1/11

CPC分类号： H05K3/3436 ,  H01L24/16 ,  H01L2224/10175 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/30105 ,  H05K1/111 ,  H05K3/3452 ,  H05K3/3489 ,  H05K2201/09036 ,  H05K2201/09781 ,  H05K2201/09809 ,  H05K2201/0989 ,  H05K2201/10977 ,  Y02P70/611 ,  Y02P70/613

摘要： A mounting structure is provided that can suppress flux from spreading, secure a connecting strength between a circuit board and an electronic component with underfill, and achieve a stable electrical connection between lands and terminals. The mounting structure is configured with a flat electronic component and a circuit board, and a plurality of lands provided on the undersurface of the electronic component and a plurality of terminals provided on the mounting surface of the circuit board so as to correspond to the plurality of lands are bonded with solder. The circuit board includes a means for holding flux separated from the solder in the proximity of at least one of the plurality of terminals.

摘要翻译： 提供了一种可以抑制磁通扩散的安装结构，通过底部填充确保电路板和电子部件之间的连接强度，并实现焊盘和端子之间的稳定的电连接。 安装结构具有扁平的电子部件和电路板，以及设置在电子部件的下表面上的多个焊盘以及设置在电路基板的安装面上的多个端子，以对应于多个 焊盘用焊料粘合。 电路板包括用于保持在焊料分离的焊剂在至少一个端子附近的装置。

公开(公告)号：US20110175224A1

公开(公告)日：2011-07-21

申请号：US13007693

申请日：2011-01-17

申请人： Taichi NAKAMURA ,  Akio Furusawa ,  Shigeaki Sakatani ,  Hidetoshi Kitaura ,  Takahiro Matsuo

发明人： Taichi NAKAMURA ,  Akio Furusawa ,  Shigeaki Sakatani ,  Hidetoshi Kitaura ,  Takahiro Matsuo

IPC分类号： H01L23/488 ,  H01L21/60

CPC分类号： H01L24/29 ,  H01L23/49513 ,  H01L24/27 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/29313 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83455 ,  H01L2224/83464 ,  H01L2224/838 ,  H01L2224/85 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01007 ,  H01L2924/01031 ,  H01L2924/01013 ,  H01L2924/01025 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01034 ,  H01L2924/3512 ,  H01L2924/01028 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A manufacturing method for a bonded structure, in which a semiconductor device is bonded to an electrode by a bonding portion, the method including: first mounting a solder ball, in which a surface of a Bi ball is coated with Ni plating, on the electrode that is heated to a temperature equal to or more than a melting point of Bi; second pressing the solder ball against the heated electrode, cracking the Ni plating, spreading molten Bi on a surface of the heated electrode, and forming a bonding material containing Bi-based intermetallic compound of Bi and Ni; and third mounting the semiconductor device on the bonding material.

摘要翻译： 一种接合结构的制造方法，其中半导体器件通过接合部分接合到电极上，所述方法包括：首先将其中Bi球的表面涂覆有Ni镀层的焊球安装在电极上 加热到等于或大于Bi的熔点的温度; 第二次将焊球压在加热电极上，破裂Ni镀层，将熔融的Bi扩散到加热电极的表面，并形成含Bi和Ni的Bi基金属间化合物的接合材料; 并且第三将半导体器件安装在接合材料上。

公开(公告)号：US20110120769A1

公开(公告)日：2011-05-26

申请号：US12999411

申请日：2010-04-19

申请人： Shigeaki Sakatani ,  Akio Furusawa ,  Kenichiro Suetsugu ,  Taichi Nakamura

发明人： Shigeaki Sakatani ,  Akio Furusawa ,  Kenichiro Suetsugu ,  Taichi Nakamura

IPC分类号： H01R4/00 ,  B23K31/02

CPC分类号： H05K3/3463 ,  B23K35/262 ,  B23K2101/36 ,  B32B15/01 ,  C22C13/00 ,  H05K3/3442 ,  H05K2201/10992 ,  Y02P70/613

摘要： A lead-free solder material is provided, which shows a high thermal fatigue resistance and is able to effectively reduce occurrence of connection failure that would cause a function of a product to stop.A solder material comprises 1.0-4.0% by weight of Ag, 4.0-6.0% by weight of In, 0.1-1.0% by weight of Bi, 1% by weight or less (excluding 0% by weight) of a sum of one or more elements selected from the group consisting of Cu, Ni, Co, Fe and Sb, and a remainder of Sn. When a copper-containing electrode part (3a) of an electronic component (3) is connected to a copper-containing electrode land (1a) of a substrate (1) by using this solder material, a part (5b) having an excellent stress relaxation property can be formed in the solder-connecting part and a Cu—Sn intermetallic compound (5a) can be rapidly grown from the electrode land (1a) and the electrode part (3a) to form a strong blocking structure. Thus, even in a severe temperature environment, cleavage can be prevented from generating and extending, a high thermal fatigue resistance can be attained, and occurrence of connection failure can be reduced.

摘要翻译： 提供了一种无铅焊料，其显示出高耐热疲劳性，并且能够有效地减少导致产品功能停止的连接故障的发生。 焊料材料包含1.0-4.0重量％的Ag，4.0-6.0重量％的In，0.1-1.0重量％的Bi，1重量％以下（不包括0重量％）的1个或 选自由Cu，Ni，Co，Fe和Sb组成的组中的更多元素，以及Sn的剩余部分。 当使用该焊料将电子部件（3）的含铜电极部（3a）与基板（1）的含铜电极焊盘（1a）连接时，具有优异应力的部分（5b） 可以在焊料连接部中形成松弛性，并且可以从电极接合区（1a）和电极部（3a）迅速地生长Cu-Sn金属间化合物（5a），形成强阻挡结构。 因此，即使在严酷的温度环境下，也可以防止产生和延伸的裂纹，可以获得高耐热疲劳性，并且可以降低连接故障的发生。