发明申请
- 专利标题： BONDING STRUCTURES AND METHODS OF FORMING BONDING STRUCTURES
- 专利标题（中）： 粘结结构和形成粘结结构的方法
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申请号： US12939241申请日： 2010-11-04
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公开(公告)号： US20110042827A1公开(公告)日： 2011-02-24
- 发明人: Szu Wei LU , Mirng-Ji Lii , Chen-Shien Chen , Hua-Shu Wu , Jerry Tzou
- 申请人： Szu Wei LU , Mirng-Ji Lii , Chen-Shien Chen , Hua-Shu Wu , Jerry Tzou
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A semiconductor structure includes a first substrate and a second substrate bonded over the first substrate. The first substrate includes a passivation layer formed over the first substrate. The passivation layer includes at least one first opening exposing a first bonding pad formed over the first substrate. The second substrate includes at least one second opening aligned with and facing the first opening.