发明申请
- 专利标题： Polishing Pad, Use Thereof and Method for Making the Same
- 专利标题（中）： 抛光垫，使用方法和制作方法
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申请号： US12862098申请日： 2010-08-24
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公开(公告)号： US20110045744A1公开(公告)日： 2011-02-24
- 发明人: Chung-Chih Feng , I-Peng Yao , Yung-Chang Hung , Lyang-Gung Wang , Wen-Chieh Wu
- 申请人： Chung-Chih Feng , I-Peng Yao , Yung-Chang Hung , Lyang-Gung Wang , Wen-Chieh Wu
- 申请人地址： TW Taoyuan County
- 专利权人： BESTAC ADVANCED MATERIAL CO., LTD.
- 当前专利权人： BESTAC ADVANCED MATERIAL CO., LTD.
- 当前专利权人地址： TW Taoyuan County
- 优先权： TW098128398 20090824
- 主分类号： B24D11/00
- IPC分类号： B24D11/00 ; B24B1/00
摘要：
The present invention relates to a polishing pad that comprises a polishing sheet for polishing a substrate, a buffer sheet comprising a plurality of holes, and adhesive for adhering the buffer sheet to the polishing sheet; wherein the adhesive is formed by polymerizing macromolecules with fluidity. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad described above are also provided.
公开/授权文献
- US08491359B2 Polishing pad, use thereof and method for making the same 公开/授权日：2013-07-23
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