Invention Application
- Patent Title: METHOD OF DIRECT ENCAPSULATION OF A THIN-FILM LITHIUM-ION TYPE BATTERY ON THE SUBSTRATE
- Patent Title (中): 在基板上直接封装薄膜锂离子电池的方法
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Application No.: US12859941Application Date: 2010-08-20
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Publication No.: US20110052979A1Publication Date: 2011-03-03
- Inventor: Pierre Bouillon , Patrick Hauttecoeur , Benoit Riou , Laurent Barreau
- Applicant: Pierre Bouillon , Patrick Hauttecoeur , Benoit Riou , Laurent Barreau
- Applicant Address: FR Tours
- Assignee: STMicroelectronics (Tours) SAS
- Current Assignee: STMicroelectronics (Tours) SAS
- Current Assignee Address: FR Tours
- Priority: FR09/55868 20090828
- Main IPC: H01M2/08
- IPC: H01M2/08

Abstract:
A method for encapsulating a thin-film lithium-ion type battery, including the steps of: forming, on a substrate, an active stack having as a lower layer a cathode collector layer extending over a surface area larger than the surface area of the other layers; forming, over the structure, a passivation layer including through openings at locations intended to receive anode collector and cathode collector contacts; forming first and second separate portions of an under-bump metallization, the first portions being located on the walls and the bottom of the openings, the second portions covering the passivation layer; and forming an encapsulation layer over the entire structure.
Public/Granted literature
- US08840686B2 Method of direct encapsulation of a thin-film lithium-ion type battery on the substrate Public/Granted day:2014-09-23
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