发明申请
- 专利标题: COMPOUND SEMICONDUCTOR SUBSTRATE
- 专利标题(中): 化合物半导体基板
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申请号: US12879035申请日: 2010-09-10
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公开(公告)号: US20110062556A1公开(公告)日: 2011-03-17
- 发明人: Jun KOMIYAMA , Kenichi Eriguchi , Hiroshi Oishi , Yoshihisa Abe , Akira Yoshida , Shunichi Suzuki
- 申请人: Jun KOMIYAMA , Kenichi Eriguchi , Hiroshi Oishi , Yoshihisa Abe , Akira Yoshida , Shunichi Suzuki
- 申请人地址: JP Shinagawa-ku
- 专利权人: COVALENT MATERIALS CORPORATION
- 当前专利权人: COVALENT MATERIALS CORPORATION
- 当前专利权人地址: JP Shinagawa-ku
- 优先权: JP2009-211189 20090914; JP2010-153634 20100706
- 主分类号: H01L29/20
- IPC分类号: H01L29/20
摘要:
A compound semiconductor substrate which inhibits the generation of a crack or a warp and is preferable for a normally-off type high breakdown voltage device, arranged that a multilayer buffer layer 2 in which AlxGa1-xN single crystal layers (0.6≦X≦1.0) 21 containing carbon from 1×1018 atoms/cm3 to 1×1021 atoms/cm3 and AlyGa1-yN single crystal layers (0.1≦y≦0.5) 22 containing carbon from 1×1017 atoms/cm3 to 1×1021 atoms/cm3 are alternately and repeatedly stacked in order, and a nitride active layer 3 provided with an electron transport layer 31 having a carbon concentration of 5×1017 atoms/cm3 or less and an electron supply layer 32 are deposited on a Si single crystal substrate 1 in order. The carbon concentrations of the AlxGa1-xN single crystal layers 21 and that of the AlyGa1-yN single crystal layers 22 respectively decrease from the substrate 1 side towards the above-mentioned active layer 3 side. In this way, the compound semiconductor substrate is produced.
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