Disposable Spacer Integration with Stress Memorization Technique and Silicon-Germanium

Invention Application

US20110070703A1 Disposable Spacer Integration with Stress Memorization Technique and Silicon-Germanium 有权

Title translation: 一次性间隔与应力记忆技术和硅锗的整合

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Patent Title: Disposable Spacer Integration with Stress Memorization Technique and Silicon-Germanium
Patent Title (中): 一次性间隔与应力记忆技术和硅锗的整合
Application No.: US12549862

Application Date: 2009-08-28
Publication No.: US20110070703A1

Publication Date: 2011-03-24
Inventor: Weize Xiong , Zhiqiang Wu , Xin Wang
Applicant: Weize Xiong , Zhiqiang Wu , Xin Wang
Applicant Address: US TX Dallas
Assignee: TEXAS INSTRUMENTS INCORPORATED
Current Assignee: TEXAS INSTRUMENTS INCORPORATED
Current Assignee Address: US TX Dallas
Main IPC: H01L21/8238
IPC: H01L21/8238

Disposable Spacer Integration with Stress Memorization Technique and Silicon-Germanium

Abstract:

An integrated process flow for forming an NMOS transistor (104) and an embedded SiGe (eSiGe) PMOS transistor (102) using a stress memorization technique (SMT) layer (126). The SMT layer (126) is deposited over both the NMOS transistor (104) and PMOS transistor (102). The portion of SMT layer (126) over PMOS transistor (102) is anisotropically etched to form spacers (128) without etching the portion of SMT layer (126) over NMOS transistor (104). Spacers (128) are used to align the SiGe recess etch and growth to form SiGe source/drain regions (132). The source/drain anneals are performed after etching the SMT layer (126) such that SMT layer (126) provides the desired stress to the NMOS transistor (104) without degrading PMOS transistor (102).

Abstract(Chinese):

一种用于使用应力存储技术（SMT）层（126）形成NMOS晶体管（104）和嵌入式SiGe（eSiGe）PMOS晶体管（102）的集成工艺流程。 SMT层（126）沉积在NMOS晶体管（104）和PMOS晶体管（102）两者之上。在PMOS晶体管（102）上方的SMT层（126）的部分被各向异性蚀刻以形成间隔物（128），而不通过NMOS晶体管（104）蚀刻SMT层（126）的部分。间隔物（128）用于对准SiGe凹陷蚀刻和生长以形成SiGe源极/漏极区域（132）。在蚀刻SMT层（126）之后执行源极/漏极退火，使得SMT层（126）在不降低PMOS晶体管（102）的情况下向NMOS晶体管（104）提供期望的应力。

Public/Granted literature

US08114727B2 Disposable spacer integration with stress memorization technique and silicon-germanium Public/Granted day:2012-02-14

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IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70	.由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/77	..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理（电可编程只读存储器或其多步骤的制造方法入H01L27/115）
H01L21/78	...把衬底连续地分成多个独立的器件（改变表面物理特性或者半导体形状的切割入H01L21/304）
H01L21/82	....制造器件，例如每一个由许多元件组成的集成电路
H01L21/822	.....衬底是采用硅工艺的半导体的（H01L21/8258优先）
H01L21/8232	......场效应工艺
H01L21/8234	.......MIS工艺
H01L21/8238	........互补场效应晶体管，例如CMOS