发明申请
- 专利标题： Abrasive-free chemical mechanical polishing compositions
- 专利标题（中）： 无磨料化学机械抛光组合物
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申请号： US12586642申请日： 2009-09-25
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公开(公告)号： US20110073800A1公开(公告)日： 2011-03-31
- 发明人: Hongyu Wang , Scott A. Ibbitson , Tirthankar Ghosh , Mark R. Winkle
- 申请人： Hongyu Wang , Scott A. Ibbitson , Tirthankar Ghosh , Mark R. Winkle
- 主分类号： C09K13/00
- IPC分类号： C09K13/00
摘要：
The aqueous abrasive-free composition is useful for chemical mechanical polishing of a patterned semiconductor wafer containing a nonferrous metal. The composition includes an oxidizer, an inhibitor for the nonferrous metal, 0 to 15 weight percent water soluble modified cellulose, 0 to 15 weight percent phosphorus compound, 0.005 to 5 weight percent of an acidic polymer, and water. The acidic polymer has a methacrylic acid portion having a carbon number of 4 to 250. The methacrylic acid portion includes either methacrylic acid or an acrylic acid/methacrylic acid copolymer. The acidic polymer including a segment from a mercapto-carboxylic acid chain transfer agent.
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