发明申请
- 专利标题： SEMICONDUCTOR DEVICE HAVING A COPPER PLUG
- 专利标题（中）： 具有铜插头的半导体器件
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申请号： US12573183申请日： 2009-10-05
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公开(公告)号： US20110079907A1公开(公告)日： 2011-04-07
- 发明人: MUKTA G. FAROOQ , Emily R. Kinser , Ian D. Melville , Krystyna W. Semkow
- 申请人： MUKTA G. FAROOQ , Emily R. Kinser , Ian D. Melville , Krystyna W. Semkow
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/768
摘要：
Disclosed is a semiconductor device wherein an insulation layer has a copper plug in contact with the last wiring layer of the device. There may also be a barrier layer separating the copper plug from the insulation layer. In a further embodiment, there may also be an aluminum layer between the insulation layer and copper plug. Also disclosed is a process for making the semiconductor device.
公开/授权文献
- US08610283B2 Semiconductor device having a copper plug 公开/授权日：2013-12-17
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