发明申请
- 专利标题： SEMICONDUCTOR DEVICE
- 专利标题（中）： 半导体器件
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申请号： US12999062申请日： 2009-10-06
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公开(公告)号： US20110089549A1公开(公告)日： 2011-04-21
- 发明人: Shin-ichi Zenbutsu , Shingo Itoh
- 申请人： Shin-ichi Zenbutsu , Shingo Itoh
- 申请人地址： JP Tokyo
- 专利权人： SUMITOMO BAKELITE CO., LTD
- 当前专利权人： SUMITOMO BAKELITE CO., LTD
- 当前专利权人地址： JP Tokyo
- 优先权： JP2008-263917 20081010; JP2009-003694 20090109; JP2009-003700 20090109
- 国际申请： PCT/JP2009/067396 WO 20091006
- 主分类号： H01L23/28
- IPC分类号： H01L23/28 ; H01L23/495
摘要：
A semiconductor device comprises a lead frame having a die pad portion or a circuit board, one or more semiconductor elements mounted on the die pad portion of the lead frame or on the circuit board, a copper wire that electrically connects electrical joints provided on the lead frame or the circuit board to an electrode pad provided on the semiconductor element, and an encapsulating member which encapsulates the semiconductor element and the copper wire, wherein the electrode pad and/or the encapsulating member having predetermined properties are combined with the copper wire having predetermined properties.
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