公开(公告)号：US20110089549A1

公开(公告)日：2011-04-21

申请号：US12999062

申请日：2009-10-06

申请人： Shin-ichi Zenbutsu ,  Shingo Itoh

发明人： Shin-ichi Zenbutsu ,  Shingo Itoh

IPC分类号： H01L23/28 ,  H01L23/495

CPC分类号： H01L23/495 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/4952 ,  H01L23/49548 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05664 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/4312 ,  H01L2224/4321 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48664 ,  H01L2224/48699 ,  H01L2224/48764 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48864 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/01105 ,  H01L2924/01202 ,  H01L2924/01204 ,  H01L2924/01205 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/30105 ,  H01L2924/01004 ,  H01L2924/01038 ,  H01L2924/01016 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01017 ,  H01L2924/01056 ,  H01L2224/82 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2924/013 ,  H01L2924/01006 ,  H01L2924/0002 ,  H01L2924/20753 ,  H01L2924/20755 ,  H01L2924/2075 ,  H01L2924/20754 ,  H01L2924/01049

摘要： A semiconductor device comprises a lead frame having a die pad portion or a circuit board, one or more semiconductor elements mounted on the die pad portion of the lead frame or on the circuit board, a copper wire that electrically connects electrical joints provided on the lead frame or the circuit board to an electrode pad provided on the semiconductor element, and an encapsulating member which encapsulates the semiconductor element and the copper wire, wherein the electrode pad and/or the encapsulating member having predetermined properties are combined with the copper wire having predetermined properties.

摘要翻译： 半导体器件包括具有管芯焊盘部分或电路板的引线框架，安装在引线框架的芯片焊盘部分或电路板上的一个或多个半导体元件，电连接引线上提供的电接头的铜线 框架或电路板连接到设置在半导体元件上的电极焊盘和封装半导体元件和铜线的封装构件，其中具有预定特性的电极焊盘和/或封装构件与预定的 属性。