发明申请
- 专利标题： METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- 专利标题（中）： 制造半导体器件和半导体器件的方法
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申请号： US12900407申请日： 2010-10-07
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公开(公告)号： US20110089563A1公开(公告)日： 2011-04-21
- 发明人: Takashi Kikuchi , Tomoaki Hashimoto , Tatsuya Hirai
- 申请人： Takashi Kikuchi , Tomoaki Hashimoto , Tatsuya Hirai
- 专利权人： RENESAS ELECTRONICS CORPORATION
- 当前专利权人： RENESAS ELECTRONICS CORPORATION
- 优先权： JP2009-238459 20091015
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/50
摘要：
Bump electrodes (conductive members) bonded onto lands disposed at a peripheral portion side than terminals (bonding leads) electrically coupled to pads (electrode pads) of a microcomputer chip (semiconductor chip) are sealed with sealing resin (a sealing body). Thereafter, the sealing resin is ground (removed) partially such that a part of each of the bump electrodes is exposed. The step of protruding the part of each of the bump electrodes from a front surface of the sealing resin is performed, after the grinding step.
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