发明申请
- 专利标题： PACKAGE STRUCTURE
- 专利标题（中）： 包装结构
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申请号： US12765619申请日： 2010-04-22
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公开(公告)号： US20110090651A1公开(公告)日： 2011-04-21
- 发明人: Sunghae Jung , Dong Suk Jun , Jong Tae Moon , Hyun-cheol Bae , Moo Jung Chu
- 申请人： Sunghae Jung , Dong Suk Jun , Jong Tae Moon , Hyun-cheol Bae , Moo Jung Chu
- 申请人地址： KR Daejeon
- 专利权人： ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- 当前专利权人： ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- 当前专利权人地址： KR Daejeon
- 优先权： KR10-2009-0098237 20091015
- 主分类号： H05K7/00
- IPC分类号： H05K7/00
摘要：
Provided is a package structure. The package structure includes a first substrate, a first device, a second substrate, a first via contact, and at least one second device. The first device is formed on the first substrate. The second substrate has an air gap over the first substrate and covers the first device. The first via contact is connected to the first device through the second substrate. At least one second device is electrically connected to the first via contact, and is stacked on the second substrate.
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