发明申请
US20110091734A1 RESIN COMPOSITION AND MULTILAYER STRUCTURE USING SAME 审中-公开
树脂组合物和使用相同的多层结构

  • 专利标题: RESIN COMPOSITION AND MULTILAYER STRUCTURE USING SAME
  • 专利标题(中): 树脂组合物和使用相同的多层结构
  • 申请号: US12991757
    申请日: 2010-03-29
  • 公开(公告)号: US20110091734A1
    公开(公告)日: 2011-04-21
  • 发明人: Osamu Kazeto
  • 申请人: Osamu Kazeto
  • 申请人地址: JP Kurashiki-shi, Okayama
  • 专利权人: Kuraray Co., Ltd.
  • 当前专利权人: Kuraray Co., Ltd.
  • 当前专利权人地址: JP Kurashiki-shi, Okayama
  • 优先权: JP2009-089133 20090401
  • 国际申请: PCT/JP2010/055594 WO 20100329
  • 主分类号: C08K5/098
  • IPC分类号: C08K5/098 B32B27/08
RESIN COMPOSITION AND MULTILAYER STRUCTURE USING SAME
摘要:
A resin composition, comprising: apolyolefin (A); a saponified ethylene-vinyl acetate copolymer (EVOH) (B) having an ethylene content of 20 to 65 mol % and having a degree of saponification of vinyl acetate units of 96% or more; a higher fatty acid metal salt (C) having 8 to 22 carbon atoms; a conjugated polyene compound (D) having a boiling point of 20° C. or higher; an ethylene-vinyl acetate copolymer (E); and a saponified ethylene-vinyl acetate copolymer (F) having an ethylene content of 68 to 98 mol % and having a degree of saponification of vinyl acetate units of 200 or more, wherein the mass ratio (A:B) of the polyolefin (A) and the EVOH (B) is 60:40 to 99.9:0.1, the amount of the higher fatty acid metal salts (C) is in the range of 0.0001 to 10 parts by mass per 100 parts by mass of the total of the polyolefin (A) and the EVOH (B), the amount of conjugated polyene compound (D) is in the range of 0.000001 to 1 part by mass, and the total amount of the ethylene-vinyl acetate copolymer (E) and the saponified ethylene-vinyl acetate copolymer (F) is 0.3 part by mass or more. This enables improvement of poor appearance of a molded article caused by insufficient dispersion of the EVOH (B) at the time of melt molding a resin composition comprising the polyolefin (A) and the EVOH (B).
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