发明申请
- 专利标题： POWER ELECTRONICS ASSEMBLY WITH MULTI-SIDED INDUCTOR COOLING
- 专利标题（中）： 功率电子组件与多面电感器冷却
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申请号： US12606803申请日： 2009-10-27
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公开(公告)号： US20110096496A1公开(公告)日： 2011-04-28
- 发明人: YOUNG M. DOO , MARK D. KORICH , KONSTANTINOS TRIANTOS
- 申请人： YOUNG M. DOO , MARK D. KORICH , KONSTANTINOS TRIANTOS
- 申请人地址： US MI DETROIT
- 专利权人： GM GLOBAL TECHNOLOGY OPERATIONS, INC.
- 当前专利权人： GM GLOBAL TECHNOLOGY OPERATIONS, INC.
- 当前专利权人地址： US MI DETROIT
- 主分类号： H05K7/20
- IPC分类号： H05K7/20 ; H01F27/08
摘要：
A power electronics assembly is provided. The assembly includes a housing defining at least one cavity and having a fluid passageway extending therethrough, the fluid passageway having first and second portions on respective first and second opposing sides of the at least one cavity, and a plurality of inductors housed within the at least one cavity of the housing such that the first and second portions of the fluid passageway are on first and second opposing sides of each of the plurality of inductors.