Disclosed is a method for fabricating fine conductive patterns using a surface modified mask template, the method including: depositing a high molecular substance on a substrate; applying a hydrophobic material onto the high molecular substance so that the hydrophobic material can infiltrate into the high molecular substance; forming a mask template by removing a part of the high molecular substance to form a recess where a region of the substrate is exposed to an outside; depositing conductive ink on the mask template; and performing annealing to abstract metal particles from a metallic compound dissolved in the conductive ink so that an insulating pattern can be formed in a region on which the high molecular substance is deposited, but a conductive pattern can be formed as the metal particles are abstracted from the conductive ink in the recess and cohere with each other.