发明申请
- 专利标题： REFLOW BONDING METHOD AND METHOD OF MANUFACTURING HEAD SUSPENSION
- 专利标题（中）： 反射粘合方法和制造头枕的方法
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申请号： US12907406申请日： 2010-10-19
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公开(公告)号： US20110101076A1公开(公告)日： 2011-05-05
- 发明人: Shogo OGAKI , Takashi Ando , Masaru Inoue
- 申请人： Shogo OGAKI , Takashi Ando , Masaru Inoue
- 申请人地址： JP Yokohama-shi
- 专利权人： NHK SPRING CO ., LTD.
- 当前专利权人： NHK SPRING CO ., LTD.
- 当前专利权人地址： JP Yokohama-shi
- 优先权： JPP2009-250239 20091030
- 主分类号： B23K31/02
- IPC分类号： B23K31/02
摘要：
A reflow bonding method easily bonds first and second wiring members together by reflowing solder arranged on at least one of first and second bonding parts that are defined on the first and second wiring members, respectively. The method includes positioning the first and second wiring members so that the first and second bonding parts face each other with the solder interposed between them and heating and pressing one of the first and second bonding parts from behind with a pressing face of a heater chip so that the first and second bonding parts lie one on another and so that the solder is heated and reflows to bond the first and second wiring members together
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