发明申请
- 专利标题： Light emitting device package and method for manufacturing the same
- 专利标题（中）： 发光器件封装及其制造方法
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申请号： US12654750申请日： 2009-12-30
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公开(公告)号： US20110101406A1公开(公告)日： 2011-05-05
- 发明人: Cheol Ho Heo , Dek Gin Yang , Myung Gun Chong
- 申请人： Cheol Ho Heo , Dek Gin Yang , Myung Gun Chong
- 申请人地址： KR Suwon
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Suwon
- 优先权： KR10-2009-0103318 20091029
- 主分类号： H01L33/00
- IPC分类号： H01L33/00 ; H01L21/50
摘要：
The present invention provides a light emitting device package including: a light emitting device structure having a light emitting device and a lead frame connected to the light emitting device; and a heat radiating structure bonded to the light emitting device structure and radiating heat generated from the light emitting device, wherein the heat radiating structure includes a conductive substrate, an insulating pattern covering a front surface of the conductive substrate opposite to the light emitting device structure, and a metal pattern bonded to the conductive substrate and the lead frame.
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IPC分类:
