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公开(公告)号：US08418356B2
公开(公告)日：2013-04-16
申请号：US12213704
申请日：2008-06-23
Applicant: Kwang Soo Park , Myung Gun Chong , Dek Gin Yang , Dae Jung Byun
Inventor： Kwang Soo Park , Myung Gun Chong , Dek Gin Yang , Dae Jung Byun
CPC classification number: H05K1/185 , H01L23/5389 , H01L24/24 , H01L24/25 , H01L24/29 , H01L24/82 , H01L24/83 , H01L2224/04105 , H01L2224/24227 , H01L2224/2518 , H01L2224/2919 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H05K3/4602 , H05K2201/10674 , H05K2203/1469 , Y10T29/4913 , Y10T29/49146 , Y10T29/49156 , H01L2924/00
Abstract: The present invention relates to an embedded printed circuit board and a manufacturing method thereof. The present invention provides an embedded printed circuit board including a substrate in which a cavity is formed in a predetermined portion and a wiring layer is formed in a portion without the cavity; a chip inserted into the cavity and including a plurality of pads; a filler filled between the chip and the cavity to fix the chip; and a connection layer formed between the wiring layer and the pads to connect the wiring layer and the pads to each other. Further, the present invention provides a manufacturing method of the embedded printed circuit board.
Abstract translation: 嵌入式印刷电路板及其制造方法技术领域本发明涉及嵌入式印刷电路板及其制造方法。 本发明提供了一种嵌入式印刷电路板，其包括基板，其中在预定部分中形成空腔，并且布线层形成在没有空腔的部分中; 插入所述腔并且包括多个垫的芯片; 填充在芯片和腔体之间的填充物以固定芯片; 以及形成在布线层和焊盘之间的连接层，以将布线层和焊盘彼此连接。 此外，本发明提供了一种嵌入式印刷电路板的制造方法。
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公开(公告)号：US20120171432A1
公开(公告)日：2012-07-05
申请号：US13373297
申请日：2011-11-10
Applicant: Chul Min Lee , Won Hyung Park , Kyung Jin Heo , Dek Gin Yang , Jin Su Yeo , Sung Wook Chun
Inventor： Chul Min Lee , Won Hyung Park , Kyung Jin Heo , Dek Gin Yang , Jin Su Yeo , Sung Wook Chun
CPC classification number: H05K3/244 , C23C18/1605 , C23C18/1651 , C23C18/44 , C23C18/54 , H05K3/243 , H05K2203/073 , Y10T428/12493 , Y10T428/12514 , Y10T428/12861 , Y10T428/12868 , Y10T428/12875 , Y10T428/24802
Abstract: Provided is a substrate structure including: a base substrate on which a conductive pattern is formed; a first plating layer covering the conductive pattern; and a second plating layer covering the first plating layer, wherein the first plating layer includes an electroless reduction plating layer.
Abstract translation: 提供一种基板结构，其包括：形成有导电图案的基底基板; 覆盖导电图案的第一镀层; 以及覆盖所述第一镀层的第二镀层，其中所述第一镀层包括无电还原镀层。
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公开(公告)号：US20100319982A1
公开(公告)日：2010-12-23
申请号：US12650477
申请日：2009-12-30
Applicant: Won Woo Cho , Dek Gin Yang , Jung Soo Kim , Hyung Ho Kim
Inventor： Won Woo Cho , Dek Gin Yang , Jung Soo Kim , Hyung Ho Kim
IPC: H01R4/00
CPC classification number: H05K1/0218 , H05K1/0236 , H05K3/429 , H05K2201/09618 , H05K2201/09627 , H05K2201/09636 , H05K2201/09718
Abstract: Disclosed herein is an electromagnetic wave shielding substrate including an electromagnetic bandgap structure which is formed along the edge thereof in order to prevent electromagnetic waves from being emitted therefrom. The electromagnetic wave shielding substrate can effectively prevent the emission of electromagnetic waves.
Abstract translation: 这里公开了一种电磁波屏蔽基板，其包括沿其边缘形成的电磁带隙结构，以防止电磁波从其发射。 电磁波屏蔽基板可以有效地防止电磁波的发射。
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公开(公告)号：US20100319980A1
公开(公告)日：2010-12-23
申请号：US12650474
申请日：2009-12-30
Applicant: Hyung Ho KIM , Dek Gin Yang , Myung Gun Chong , Jung Soo Kim , Won Woo Cho
Inventor： Hyung Ho KIM , Dek Gin Yang , Myung Gun Chong , Jung Soo Kim , Won Woo Cho
CPC classification number: H05K1/0236 , H05K2201/09309 , H05K2201/09627
Abstract: Disclosed herein is a printed circuit board. When power layers for supplying different voltages are sequentially stacked, a first EBG cell formed between a first power layer and a ground layer is arranged within a second EBG cell formed between a second power layer and the ground layer to allow the first EBG cell and the second EBG cell to have a double EBG structure. Accordingly, the present invention can prevent a DC open state while preventing noise and realizing band-stop characteristics.
Abstract translation: 这里公开了一种印刷电路板。 当依次堆叠用于提供不同电压的功率层时，形成在第一功率层和接地层之间的第一EBG单元被布置在形成在第二功率层和接地层之间的第二EBG单元内，以允许第一EBG单元和 第二EBG细胞具有双EBG结构。 因此，本发明可以在防止噪声并实现带阻特性的同时防止DC打开状态。
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公开(公告)号：US07810232B2
公开(公告)日：2010-10-12
申请号：US11976617
申请日：2007-10-25
Applicant: Keun-Ho Kim , Dek-Gin Yang , Jong-Guk Kim , II-Kyoon Jeon , Eung-Suek Lee
Inventor： Keun-Ho Kim , Dek-Gin Yang , Jong-Guk Kim , II-Kyoon Jeon , Eung-Suek Lee
IPC: H05K3/36
CPC classification number: H05K3/4641 , H05K1/0206 , H05K1/0207 , H05K1/056 , H05K3/4069 , H05K3/4608 , H05K3/4614 , H05K3/4647 , H05K2201/0355 , H05K2201/09554 , H05K2201/096 , H05K2203/1189 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165
Abstract: A printed circuit board and manufacturing method thereof. A printed circuit board has an insulation substrate, which includes an insulation layer, a circuit pattern formed on one side of the insulation layer, and an interlayer passage joined to the insulation layer and configured to electrically connect with the circuit pattern, and a heat-release layer, which is stacked on the other side of the insulation layer to be stacked on the insulation substrate, can provide a high heat-releasing effect and high bending strength, by means of inner layers or ground layers formed by the heat-release layers.
Abstract translation: 印刷电路板及其制造方法。 印刷电路板具有绝缘基板，该绝缘基板包括绝缘层，形成在绝缘层的一侧的电路图案，以及与该绝缘层接合并被构造为与电路图形电连接的层间通道， 层叠在绝缘层的另一方的层叠在绝缘基板上的剥离层能够通过由散热层形成的内层或接地层提供高散热效果和高弯曲强度 。
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Patent Agency Ranking
公开(公告)号：US20100252320A1
公开(公告)日：2010-10-07
申请号：US12650489
申请日：2009-12-30
Applicant: Won Woo CHO , Young Soo Kim , Yoon Jung Kim , Dek Gin Yang , Myung Gun Chong , Hyung Ho Kim
Inventor： Won Woo CHO , Young Soo Kim , Yoon Jung Kim , Dek Gin Yang , Myung Gun Chong , Hyung Ho Kim
IPC: H05K9/00
CPC classification number: H05K1/0236 , H05K1/165 , H05K2201/09309 , H05K2201/09627
Abstract: Disclosed herein are an electromagnetic bandgap structure and a printed circuit board having the same. The bandgap structure includes a conductive layer including a plurality of conductive plates, a first metal layer disposed under the conductive layer and including a first stitching pattern electrically connected to a first conductive plate of the plurality of conductive plates, and a second metal layer disposed under the first metal layer and including a second stitching pattern electrically connected to both the first stitching pattern and a second conductive plate of the plurality of conductive plates. The bandgap to structure includes stitching patterns formed in two layers different from the conductive layer, thus offering a stop-band having a desired bandwidth in a compact structure.
Abstract translation: 本文公开了一种电磁带隙结构和具有该电阻带隙结构的印刷电路板。 所述带隙结构包括导电层，所述导电层包括多个导电板，第一金属层，设置在所述导电层下方，并且包括电连接到所述多个导电板中的第一导电板的第一拼接图案;以及第二金属层， 第一金属层并且包括电连接到多个导电板的第一缝合图案和第二导电板的第二缝合图案。 结构的带隙包括形成在与导电层不同的两层中的缝合图案，从而在紧凑的结构中提供具有期望带宽的阻挡带。
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公开(公告)号：US07347950B2
公开(公告)日：2008-03-25
申请号：US11214965
申请日：2005-08-29
Applicant: Bum Young Myung , Dong Kuk Kim , Young Po Park , Young Seok Yoon , Dek Gin Yang
Inventor： Bum Young Myung , Dong Kuk Kim , Young Po Park , Young Seok Yoon , Dek Gin Yang
CPC classification number: H05K3/4691 , C23C26/00 , C23C28/00 , C23C28/023 , H05K3/4652 , H05K2201/0187 , H05K2201/0355 , H05K2201/0382 , H05K2201/09109 , H05K2203/063 , Y10T29/49155
Abstract: A rigid flexible printed circuit board (PCB) and a method of fabricating the same. Since a polyimide copper clad laminate is not used during the fabrication of the rigid flexible PCB, an increase in cost resulting from use of the polyimide copper clad laminate and poor reliability of adhesion at an interface between different materials are avoided.
Abstract translation: 一种刚性柔性印刷电路板（PCB）及其制造方法。 由于在刚性柔性PCB的制造期间不使用聚酰亚胺覆铜层压板，所以避免了使用聚酰亚胺覆铜层压板所产生的成本的增加以及在不同材料之间的界面处的粘附可靠性差。
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8.发明申请公开(公告)号：US20070154134A1
公开(公告)日：2007-07-05
申请号：US11713496
申请日：2007-03-01
Applicant: Sang-Won Ha , Byoung-Ho Rhee , Keun-Ho Kim , Kyoung-UP Shin , Dek-Gin Yang
Inventor： Sang-Won Ha , Byoung-Ho Rhee , Keun-Ho Kim , Kyoung-UP Shin , Dek-Gin Yang
IPC: G02B6/12
CPC classification number: G02B6/138 , G02B6/1221 , H05K1/0274
Abstract: Disclosed is a PCB in which a waveguide is embedded, and a method of producing the same. The PCB includes a substrate, and a lower clad layer formed on the substrate through a predetermined process to allow an optical signal irradiated thereto to be total-reflected thereby. A core layer is formed on the lower clad layer through a predetermined process and exposed using an exposing film on which a waveguide pattern is formed to form the waveguide with a predetermined shape therefrom. Furthermore, an upper clad layer is formed on the core layer through a predetermined process to allow the optical signal irradiated thereto to be total-reflected thereby.
Abstract translation: 公开了嵌入波导的PCB及其制造方法。 PCB包括基板和通过预定工艺在基板上形成的允许从其照射的光信号全反射的下包层。 通过预定工艺在下包层上形成芯层，并使用其上形成有波导图案的曝光膜进行曝光，以形成具有预定形状的波导。 此外，通过预定处理在芯层上形成上覆盖层，以使得其被辐射的光信号被全反射。
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9.发明授权公开(公告)号：US07046870B2
公开(公告)日：2006-05-16
申请号：US10610820
申请日：2003-07-02
Applicant: Young-Woo Kim , Young-Sang Cho , Dek-Gin Yang , Kyu-Hyok Yim
Inventor： Young-Woo Kim , Young-Sang Cho , Dek-Gin Yang , Kyu-Hyok Yim
CPC classification number: G02B6/43 , G02B6/3608 , G02B6/4201 , G02B6/4214 , G02B6/428 , H05K1/0274 , H05K3/4611 , H05K2203/063 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T156/1064
Abstract: Disclosed is a method of fabricating a multi-layered PCB, in which the optical waveguide component is inserted into the PCB in such a way that a prepreg adhesive does not block an optical signal entrance of the optical waveguide. The method comprises pre-routing a portion of an adhesive meeting the optical waveguide to remove said portion, processing an adhesive weeping prevention layer so as to prevent the adhesive from blocking the optical signal entrance of the optical waveguide, arranging the optical waveguide, the adhesive, and the adhesive weeping prevention layer on a copper clad laminate, and combining the optical waveguide, a prepreg, and the adhesive weeping prevention layer with each other into a single structure. The adhesive weeping prevention layer is selected from the group consisting of a prepreg, a single-sided copper clad laminate, a thermally curable resin, a heat spreader, and an unclad.
Abstract translation: 公开了一种制造多层PCB的方法，其中将光波导部件插入到PCB中，使得预浸胶粘合剂不阻挡光波导的光信号入口。 该方法包括预先路由满足光波导的粘合剂部分以去除所述部分，处理粘合剂防止漏水层，以防止粘合剂阻挡光波导的光信号入口，布置光波导，粘合剂 和覆铜层压板上的粘合剂防止层，并将光波导，预浸料和粘合剂防止层彼此组合成单一结构。 粘合防止层选自预浸料，单面覆铜层压板，热固化树脂，散热器和未包覆层。
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公开(公告)号：US20050106368A1
公开(公告)日：2005-05-19
申请号：US10790191
申请日：2004-03-02
Applicant: Sang-Won Ha , Byoung-Ho Rhee , Kyoung-Hwan Lim , Kyoung-Up Shin , Dek-Gin Yang
Inventor： Sang-Won Ha , Byoung-Ho Rhee , Kyoung-Hwan Lim , Kyoung-Up Shin , Dek-Gin Yang
IPC: G02B6/42 , B32B15/08 , B32B15/14 , B32B27/38 , C08J5/24 , G02B6/00 , G02B6/122 , G02B6/13 , G02B6/36 , G02B6/43 , G02B6/44 , H05K1/02 , H05K1/03 , H05K3/02 , H05K3/10 , B05D5/12 , B32B3/00
CPC classification number: B32B15/20 , B32B15/14 , B32B37/10 , B32B2305/076 , B32B2457/08 , G02B6/138 , G02B6/3612 , G02B6/43 , G02B6/448 , H05K1/0274 , H05K3/022 , Y10T428/24917
Abstract: Disclosed is a PCB in which copper clads are formed on both sides or any one side of a semicured prepreg having a structure that optical fibers disposed at regular intervals by fixing jigs are embedded in an epoxy resin, and a method of producing the same. Furthermore, the present invention provides a PCB, in which copper clads are formed on both sides or any one side of a semicured prepreg having a structure that a waveguide layer to transmit an optical signal therethrough is embedded in an epoxy resin.
Abstract translation: 公开了一种PCB，其中在具有通过固定夹具以规则间隔布置的光纤被嵌入环氧树脂中的半固化预浸料的两侧或任一侧上形成铜包层及其制造方法。 此外，本发明提供了一种PCB，其中铜包层形成在半固化预浸料的两侧或任一侧上，该半固化预浸料具有将透过其中的光信号的波导层嵌入环氧树脂中的结构。
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