发明申请
- 专利标题： Copper Bump Joint Structures with Improved Crack Resistance
- 专利标题（中）： 具有提高抗裂性的铜凸块接头结构
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申请号： US12619468申请日： 2009-11-16
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公开(公告)号： US20110101526A1公开(公告)日： 2011-05-05
- 发明人: Ching-Wen Hsiao , Jiun Yi Wu , Ru-Ying Huang , Chen-Shien Chen
- 申请人： Ching-Wen Hsiao , Jiun Yi Wu , Ru-Ying Huang , Chen-Shien Chen
- 主分类号： H01L23/52
- IPC分类号： H01L23/52 ; H01L23/538
摘要：
An integrated circuit structure includes a first work piece and a second work piece. The first work piece includes a semiconductor substrate, and a copper bump over the semiconductor substrate. The second work piece includes a bond pad. A solder is between and adjoining the first work piece and the second work piece, wherein the solder electrically connects the copper bump to the bond pad. The solder includes palladium.
公开/授权文献
- US09607936B2 Copper bump joint structures with improved crack resistance 公开/授权日：2017-03-28
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