发明申请
- 专利标题： SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF
- 专利标题（中）： 半导体器件及其制造方法
-
申请号： US12940419申请日： 2010-11-05
-
公开(公告)号： US20110101530A1公开(公告)日： 2011-05-05
- 发明人: Noboru MORIMOTO , Masahiko Fujisawa , Daisuke Kodama
- 申请人： Noboru MORIMOTO , Masahiko Fujisawa , Daisuke Kodama
- 申请人地址： JP Chiyoda-ku
- 专利权人： Renesas Technology Corp.
- 当前专利权人： Renesas Technology Corp.
- 当前专利权人地址： JP Chiyoda-ku
- 优先权： JP2005-309745 20051025
- 主分类号： H01L23/532
- IPC分类号： H01L23/532
摘要：
A seal ring is provided between a region where a circuit is formed on a semiconductor substrate and a dicing region. The seal ring has a portion where sealing layers of which the cross sectional form is in T-shape are layered and a portion where sealing layers of which the cross sectional form is rectangular are layered.
公开/授权文献
- US08169080B2 Semiconductor device and method of manufacture thereof 公开/授权日：2012-05-01
信息查询
IPC分类:
