Invention Application
- Patent Title: MULTILAYER STRUCTURE, CAPACITOR INCLUDING THE MULTILAYER STRUCTURE AND METHOD OF FORMING THE SAME
- Patent Title (中): 多层结构,包括多层结构的电容器及其形成方法
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Application No.: US12838296Application Date: 2010-07-16
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Publication No.: US20110102968A1Publication Date: 2011-05-05
- Inventor: Jae-Hyoung CHOI , Youn-Soo Kim , Jung-Hyeon Kim , Wan-Don Kim , Jae-Soon Lim , Sang-Yeol Kang
- Applicant: Jae-Hyoung CHOI , Youn-Soo Kim , Jung-Hyeon Kim , Wan-Don Kim , Jae-Soon Lim , Sang-Yeol Kang
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Priority: KR10-2009-0065739 20090720
- Main IPC: H01G4/008
- IPC: H01G4/008 ; B32B9/04 ; B05D5/12 ; C23C14/34

Abstract:
In a multilayer structure and a method of forming the same, a conductive layer including a metal nitride and a dielectric layer positioned on a surface of the conductive layer and having a high dielectric constant. The metal nitride comprises one of niobium, vanadium and compositions thereof. Thus, the EOT and leakage current of the multilayer structure may be sufficiently improved.
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