发明申请
US20110104872A1 Method of manufacturing a semiconductor device having a heat spreader
审中-公开
具有散热器的半导体器件的制造方法
- 专利标题： Method of manufacturing a semiconductor device having a heat spreader
- 专利标题（中）： 具有散热器的半导体器件的制造方法
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申请号： US12929291申请日： 2011-01-12
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公开(公告)号： US20110104872A1公开(公告)日： 2011-05-05
- 发明人: Yuko Sato , Takehiko Maeda , Fumiyoshi Kawashiro
- 申请人： Yuko Sato , Takehiko Maeda , Fumiyoshi Kawashiro
- 申请人地址： JP Kawasaki-shi
- 专利权人： RENESAS ELECTRONICS CORPORATION
- 当前专利权人： RENESAS ELECTRONICS CORPORATION
- 当前专利权人地址： JP Kawasaki-shi
- 优先权： JP273141/2008 20081023
- 主分类号： H01L21/82
- IPC分类号： H01L21/82
摘要：
A semiconductor device manufacturing method includes cutting a resin sealing body into a plurality of pieces, in which the resin sealing body includes a plurality of semiconductor chips mounted on a wiring board, a heat spreader disposed above the plurality of the semiconductor chips, and a sealing resin filled between the wiring board and the heat spreader. The cutting the resin sealing body includes shaving the resin sealing body from a side of the heat spreader, and shaving the resin sealing body from a side of the wiring board. The shaving the resin sealing body from the side of the heat spreader includes etching the heat spreader.
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