发明申请
US20110111554A1 MEMORY DEVICE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING MEMORY DEVICE
有权
存储器件,半导体器件和用于制造存储器件的方法
- 专利标题: MEMORY DEVICE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING MEMORY DEVICE
- 专利标题(中): 存储器件,半导体器件和用于制造存储器件的方法
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申请号: US13008148申请日: 2011-01-18
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公开(公告)号: US20110111554A1公开(公告)日: 2011-05-12
- 发明人: Hisao IKEDA , Takahiro IBE , Junichi KOEZUKA , Kaoru KATO
- 申请人: Hisao IKEDA , Takahiro IBE , Junichi KOEZUKA , Kaoru KATO
- 申请人地址: JP Atsugi-shi
- 专利权人: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- 当前专利权人: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- 当前专利权人地址: JP Atsugi-shi
- 优先权: JP2007-096977 20070403
- 主分类号: H01L51/40
- IPC分类号: H01L51/40
摘要:
Objects are to solve inhibition of miniaturization of a memory element and complexity of a manufacturing process thereof, and to provide a nonvolatile memory device and a semiconductor device each having the memory device, in which data can be additionally written except at the time of manufacture and in which forgery or the like caused by rewriting of data can be prevented, and a memory device and a semiconductor device that are inexpensive and nonvolatile. The present invention provides a semiconductor device that includes a plurality of memory elements, in each of which a first conductive layer, a second conductive layer disposed beside the first conductive layer, and a mixed film that are disposed over the same insulating film. The mixed film contains an inorganic compound, an organic compound, and a halogen atom and is disposed between the first conductive layer and the second conductive layer.
公开/授权文献
- US08187917B2 Method for manufacturing memory device 公开/授权日:2012-05-29
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