发明申请
- 专利标题： THERMOSETTING ADHESIVE FILM, ADHESIVE FILM WITH DICING FILM, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE THERMOSETTING ADHESIVE FILM OR THE ADHESIVE FILM WITH DICING FILM
- 专利标题（中）： 热固性胶膜，带薄膜的粘合膜，以及使用热固性胶膜制造半导体器件的方法或带有薄膜的粘合膜
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申请号： US12948992申请日： 2010-11-18
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公开(公告)号： US20110120614A1公开(公告)日： 2011-05-26
- 发明人: Yuki Sugo , Kouichi Inoue , Kenji Oonishi
- 申请人： Yuki Sugo , Kouichi Inoue , Kenji Oonishi
- 优先权： JP2009-269087 20091126; JP2010-224088 20101001
- 主分类号： H01L21/50
- IPC分类号： H01L21/50 ; B32B5/00 ; B32B3/00 ; C09J7/00 ; C09J7/02
摘要：
The present invention provides a thermosetting adhesive film that is capable of improving the package reliability by preventing damage of a semiconductor chip due to pressure during die bonding of the film having a configuration where a filler is not substantially added, preventing a decrease of tensile storage modulus and preventing generation of warping due to heat shrinkage during thermosetting. It is a thermosetting adhesive film used at the time of manufacturing a semiconductor device, the film having a tensile storage modulus at 260° C. after thermosetting of 2×105 to 5×107 Pa, a content of a filler of 0.1% by weight or less based on the entire thermosetting adhesive film, and a thickness of 1 to 10 μm.
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