公开(公告)号：US20110120614A1

公开(公告)日：2011-05-26

申请号：US12948992

申请日：2010-11-18

申请人： Yuki Sugo ,  Kouichi Inoue ,  Kenji Oonishi

发明人： Yuki Sugo ,  Kouichi Inoue ,  Kenji Oonishi

IPC分类号： H01L21/50 ,  B32B5/00 ,  B32B3/00 ,  C09J7/00 ,  C09J7/02

CPC分类号： C08G59/621 ,  C08L33/00 ,  C08L33/08 ,  C08L61/04 ,  C08L63/00 ,  C08L63/08 ,  C08L71/00 ,  C08L2205/03 ,  C08L2666/02 ,  C09J7/10 ,  C09J133/08 ,  C09J161/06 ,  C09J163/00 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2463/00 ,  H01L21/561 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/29023 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83097 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/85097 ,  H01L2224/85205 ,  H01L2224/9205 ,  H01L2224/92165 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/15747 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T156/10 ,  Y10T428/24355 ,  Y10T428/265 ,  H01L2224/27 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/85399

摘要： The present invention provides a thermosetting adhesive film that is capable of improving the package reliability by preventing damage of a semiconductor chip due to pressure during die bonding of the film having a configuration where a filler is not substantially added, preventing a decrease of tensile storage modulus and preventing generation of warping due to heat shrinkage during thermosetting. It is a thermosetting adhesive film used at the time of manufacturing a semiconductor device, the film having a tensile storage modulus at 260° C. after thermosetting of 2×105 to 5×107 Pa, a content of a filler of 0.1% by weight or less based on the entire thermosetting adhesive film, and a thickness of 1 to 10 μm.

摘要翻译： 本发明提供一种热固性粘合剂膜，其能够通过防止由于在具有未充分填充填料的构造的膜的芯片接合期间的压力导致的半导体芯片的损坏而提高封装可靠性，防止了拉伸储能模量的降低 并且防止由于热固化期间的热收缩而产生翘曲。 作为制造半导体装置时使用的热固性粘合膜，该膜在2×105〜5×107Pa的热固化后的拉伸储能模量为260℃，填料的含量为0.1重量％ 或更低，基于整个热固性粘合剂膜，厚度为1至10μm。

公开(公告)号：US08779586B2

公开(公告)日：2014-07-15

申请号：US13036277

申请日：2011-02-28

申请人： Kenji Oonishi ,  Miki Hayashi ,  Kouichi Inoue ,  Yuichiro Shishido

发明人： Kenji Oonishi ,  Miki Hayashi ,  Kouichi Inoue ,  Yuichiro Shishido

IPC分类号： H01L25/11

CPC分类号： H01L24/27 ,  C09J7/10 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2463/00 ,  H01L21/6836 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/27436 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/85206 ,  H01L2224/85207 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/3025 ,  Y10T428/24959 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/287 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/05442 ,  H01L2924/0532 ,  H01L2924/05432 ,  H01L2924/05032 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The present invention provides a die bond film for adhering, onto a semiconductor element that is electrically connected to an adherend with a bonding wire, another semiconductor element and that enables loading of the other semiconductor element and improvement in the manufacturing yield of a semiconductor device by preventing deformation and cutting of the bonding wire, and a dicing die bond film. The die bond film of the present invention is a die bond film for adhering, onto a semiconductor element that is electrically connected to an adherend with a bonding wire, another semiconductor element, in which at least a first adhesive layer that enables a portion of the bonding wire to pass through inside thereof by burying the portion upon press bonding and a second adhesive layer that prevents the other semiconductor element from contacting with the bonding wire are laminated.

摘要翻译： 本发明提供一种芯片接合薄膜，用于通过接合线与另一个半导体元件电连接到与被粘物电连接的半导体元件上，并且能够通过以下方式将其它半导体元件加载并提高半导体器件的制造成品率 防止接合线的变形和切断，以及切割模接合膜。 本发明的芯片接合薄膜是一种芯片接合薄膜，用于将至少一个第一粘合剂层粘合到与接合线电连接到被粘物的半导体元件上， 接合线通过在压接时埋入该部分而通过其内部，并且层压防止另一半导体元件与接合线接触的第二粘合层。

公开(公告)号：US20110210455A1

公开(公告)日：2011-09-01

申请号：US13036277

申请日：2011-02-28

申请人： Kenji Oonishi ,  Miki Hayashi ,  Kouichi Inoue ,  Yuichiro Shishido

发明人： Kenji Oonishi ,  Miki Hayashi ,  Kouichi Inoue ,  Yuichiro Shishido

IPC分类号： H01L23/00 ,  B32B27/38 ,  C09J7/00 ,  B32B7/12

CPC分类号： H01L24/27 ,  C09J7/10 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2463/00 ,  H01L21/6836 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/27436 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/85206 ,  H01L2224/85207 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/3025 ,  Y10T428/24959 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/287 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/05442 ,  H01L2924/0532 ,  H01L2924/05432 ,  H01L2924/05032 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The present invention provides a die bond film for adhering, onto a semiconductor element that is electrically connected to an adherend with a bonding wire, another semiconductor element and that enables loading of the other semiconductor element and improvement in the manufacturing yield of a semiconductor device by preventing deformation and cutting of the bonding wire, and a dicing die bond film. The die bond film of the present invention is a die bond film for adhering, onto a semiconductor element that is electrically connected to an adherend with a bonding wire, another semiconductor element, in which at least a first adhesive layer that enables a portion of the bonding wire to pass through inside thereof by burying the portion upon press bonding and a second adhesive layer that prevents the other semiconductor element from contacting with the bonding wire are laminated.

摘要翻译： 本发明提供一种芯片接合薄膜，用于通过接合线与另一个半导体元件电连接到与被粘物电连接的半导体元件上，并且能够通过以下方式将其它半导体元件加载并提高半导体器件的制造成品率 防止接合线的变形和切断，以及切割模接合膜。 本发明的芯片接合薄膜是一种芯片接合薄膜，用于将至少一个第一粘合剂层粘合到与接合线电连接到被粘物的半导体元件上， 接合线通过在压接时埋入该部分而通过其内部，并且层压防止另一半导体元件与接合线接触的第二粘合层。

公开(公告)号：US20110057331A1

公开(公告)日：2011-03-10

申请号：US12875383

申请日：2010-09-03

申请人： Miki Hayashi ,  Shumpei Tanaka ,  Kenji Oonishi ,  Yuuichirou Shishido ,  Kouichi Inoue

发明人： Miki Hayashi ,  Shumpei Tanaka ,  Kenji Oonishi ,  Yuuichirou Shishido ,  Kouichi Inoue

IPC分类号： H01L23/52

CPC分类号： H01L21/6836 ,  C09J7/22 ,  C09J7/38 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2463/00 ,  H01L24/45 ,  H01L24/73 ,  H01L2221/68336 ,  H01L2221/68381 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85207 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/00014

摘要： An object of the present invention is to provide a thermosetting die-bonding film with which a die-bonding film is suitably broken with a tensile force. The object is achieved by a thermosetting die-bonding, film at least having an adhesive layer that is used to fix a semiconductor chip to an adherend, in which the breaking energy per unit area is 1 J/mm2 or less and the elongation at break is 40% or more to 500% or less at room temperature before thermal setting.

摘要翻译： 本发明的一个目的是提供一种热塑性芯片接合薄膜，通过该热固性芯片接合薄膜，该拉伸粘合薄膜被适当地断裂。 该目的通过热固性芯片接合来实现，其中至少具有用于将半导体芯片固定到被粘物上的粘合剂层，其中每单位面积的断裂能为1J / mm 2或更小，断裂伸长率 在热固化之前的室温下为40％以上至500％以下。

公开(公告)号：US20120153508A1

公开(公告)日：2012-06-21

申请号：US13141765

申请日：2009-12-22

申请人： Miki Hayashi ,  Naohide Takamoto ,  Kenji Oonishi

发明人： Miki Hayashi ,  Naohide Takamoto ,  Kenji Oonishi

IPC分类号： H01L23/488 ,  H01L21/60 ,  H01L21/78 ,  C08L63/00

CPC分类号： H01L23/3121 ,  C08L33/08 ,  C08L63/00 ,  C08L2666/22 ,  C09J7/10 ,  C09J133/08 ,  C09J161/06 ,  C09J163/00 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2463/00 ,  H01L21/565 ,  H01L23/293 ,  H01L23/296 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/85207 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/00013 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/05442 ,  H01L2924/0532 ,  H01L2924/05432 ,  H01L2924/05032 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2924/20752

摘要： An object of the present invention is to provide a thermosetting die-bonding film having both storage modulus and high adhering strength that are necessary in manufacturing a semiconductor device and to provide a dicing die-bonding film including the thermosetting die-bonding film. The thermosetting die-bonding film of the present invention is a thermosetting die-bonding film that is used in manufacture of a semiconductor device and includes at least an epoxy resin, a phenol resin, an acrylic copolymer, and a filler, has a storage modulus at 80 to 140° C. before thermal curing in a range of 10 kPa to 10 MPa and a storage modulus at 175° C. before thermal curing in a range of 0.1 to 3 MPa.

摘要翻译： 本发明的目的是提供一种在制造半导体器件中所需的储能模量和高粘附强度的热固性芯片接合薄膜，并提供包括该热固性芯片接合薄膜的切割芯片接合薄膜。 本发明的热固性芯片接合薄膜是用于制造半导体器件的至少包含环氧树脂，酚醛树脂，丙烯酸共聚物和填料的热固性芯片接合薄膜，具有储能模量 在热固化前，在10〜10MPa的范围内，在80〜140℃下进行热固化，在热固化前的储能模量为175℃，为0.1〜3MPa。

公开(公告)号：US5423052A

公开(公告)日：1995-06-06

申请号：US21431

申请日：1993-02-23

申请人： Kenji Oonishi ,  Tsunenori Umeki

发明人： Kenji Oonishi ,  Tsunenori Umeki

IPC分类号： G06F7/38 ,  G06F7/508 ,  G06F7/57 ,  G06F9/305 ,  G06F9/00 ,  G06F9/302

CPC分类号： G06F7/57

摘要： For obtaining a central processing unit to perform, with the same operation code, an operation in which a carry input is effective and an operation in which the carry input is invalid or an operation in which a borrow input is effective and an operation in which the borrow input is invalid, between an output of a carry and borrow flag and a carry and borrow input of an ALU there is provided a switching circuit to switch the input of the ALU by a control signal different from a control signal of the central processing unit due to an operation code.

摘要翻译： 为了获得中央处理单元，以相同的操作代码执行进位输入有效的操作和进位输入无效的操作或者借用输入有效的操作，以及操作 借位输入无效，在进位和借位标志的输出与ALU的进位和借位输入之间提供切换电路，以通过与中央处理单元的控制信号不同的控制信号切换ALU的输入 由于操作代码。

公开(公告)号：US09630615B2

公开(公告)日：2017-04-25

申请号：US14219428

申请日：2014-03-19

申请人： Kenji Oonishi ,  Koji Hokoi ,  Daisuke Itoyama ,  Hiroki Endo ,  Kazuma Aoki ,  Hideaki Yaguchi ,  Mikihisa Arai

发明人： Kenji Oonishi ,  Koji Hokoi ,  Daisuke Itoyama ,  Hiroki Endo ,  Kazuma Aoki ,  Hideaki Yaguchi ,  Mikihisa Arai

IPC分类号： B60L9/00 ,  B60W20/15 ,  B60W20/40 ,  B60W50/08 ,  B60W20/50 ,  B60W20/18 ,  B60K6/20 ,  B60W10/08

CPC分类号： B60W20/15 ,  B60K6/20 ,  B60W10/08 ,  B60W20/18 ,  B60W20/40 ,  B60W20/50 ,  B60W50/082 ,  B60W2400/00 ,  B60W2560/04 ,  B60W2710/08 ,  B60Y2300/182 ,  Y02T10/6239 ,  Y02T10/6286 ,  Y02T10/7077 ,  Y02T10/84 ,  Y10S903/902 ,  Y10S903/93

摘要： A hybrid vehicle includes: an engine configured to output power for traveling; a motor configured to output power for traveling; a switch configured to set a fuel economy priority mode, in which priority is given to fuel economy, and to cancel the fuel economy priority mode; and a controller configured (a) to operate the engine and the motor based on the switch setting; (b) to determine the presence/absence of degradation of fuel supplied to the engine; and (c) to prohibit setting of the fuel economy priority mode by the switch subsequently when determination is made that the fuel has degraded when the hybrid vehicle travels using power of the motor in a state in which the drive of the engine is stopped.

公开(公告)号：US06838927B2

公开(公告)日：2005-01-04

申请号：US10330171

申请日：2002-12-30

申请人： Kenji Oonishi

发明人： Kenji Oonishi

IPC分类号： H01L27/04 ,  G05F1/46 ,  H01L21/822 ,  H03K3/01

CPC分类号： G05F1/465

摘要： A semiconductor integrated circuit with stabilizing capacity has a voltage drop circuit that drops a power supply voltage to a first voltage Vcc1 and supplies the Vcc1 to a plurality of function blocks; a stabilizing capacity that stabilizes the Vcc1; and a plurality of voltage switching circuits each of which is provided in each of the function blocks and selectively switches between the Vcc1 and a base voltage Vss to produce a second voltage Vcc2 and supplies the Vcc2 to each function block, and each of the function blocks forms a capacity for stabilizing an output of the voltage drop circuit by means of its semiconductor structure by the Vcc1 and the Vcc2 applied thereto.

摘要翻译： 具有稳定容量的半导体集成电路具有将电源电压降低到第一电压Vcc1并将Vcc1提供给多个功能块的电压降电路; 稳定Vcc1的稳定能力; 以及多个电压切换电路，每个电压切换电路设置在每个功能块中，并且选择性地在Vcc1和基极电压Vss之间切换以产生第二电压Vcc2，并将Vcc2提供给每个功能块，并且每个功能块 形成通过其施加到其上的Vcc1和Vcc2通过其半导体结构稳定电压降电路的输出的能力。

公开(公告)号：US10220829B2

公开(公告)日：2019-03-05

申请号：US14988207

申请日：2016-01-05

申请人： Kenji Oonishi ,  Koji Hokoi ,  Daisuke Itoyama ,  Hiroki Endo ,  Kazuma Aoki ,  Hideaki Yaguchi ,  Mikihisa Arai

发明人： Kenji Oonishi ,  Koji Hokoi ,  Daisuke Itoyama ,  Hiroki Endo ,  Kazuma Aoki ,  Hideaki Yaguchi ,  Mikihisa Arai

IPC分类号： B60L9/00 ,  B60W20/15 ,  B60W20/40 ,  B60W50/08 ,  B60W20/50 ,  B60W20/18 ,  B60K6/20 ,  B60W10/08

摘要： A hybrid vehicle includes: an engine configured to output power for traveling; a motor configured to output power for traveling; a switch configured to set a fuel economy priority mode, in which priority is given to fuel economy, and to cancel the fuel economy priority mode; and a controller configured (a) to operate the engine and the motor based on the switch setting; (b) to determine the presence/absence of degradation of fuel supplied to the engine; and (c) to prohibit setting of the fuel economy priority mode by the switch subsequently when determination is made that the fuel has degraded when the hybrid vehicle travels using power of the motor in a state in which the drive of the engine is stopped.

公开(公告)号：US08010270B2

公开(公告)日：2011-08-30

申请号：US12252228

申请日：2008-10-15

申请人： Kiyoshiro Ueoka ,  Kenji Oonishi

发明人： Kiyoshiro Ueoka ,  Kenji Oonishi

IPC分类号： G06F7/70 ,  G05D1/00 ,  B60K6/20

CPC分类号： B60T7/122 ,  B60L15/2063 ,  B60L15/2081 ,  B60T2201/06 ,  Y02T10/645 ,  Y02T10/72 ,  Y02T10/7275

摘要： An ECU releases brake hold control when an actual accelerator pedal position A exceeds a predetermined position A(0) while the brake hold control is being executed. Further, the ECU determines whether or not the actual accelerator pedal position A is larger than a position A(1), which is a value smaller than the predetermined position A(0), and if it is larger than the predetermined position A(1), executes a process for increasing a creep torque reflection ratio R to recover creep force that has been stopped.

摘要翻译： 当执行制动保持控制时，当实际的加速器踏板位置A超过预定位置A（0）时，ECU释放制动保持控制。 此外，ECU判定实际的加速踏板位置A是否大于比规定位置A（0）小的值的位置A（1），如果大于预定位置A（1） ），执行用于增加蠕变扭矩反射率R以恢复已经停止的蠕变力的处理。