发明申请
- 专利标题： CIRCUIT BOARD, ITS MANUFACTURING METHOD, AND JOINT BOX USING CIRCUIT BOARD
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申请号： US13006122申请日： 2011-01-13
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公开(公告)号： US20110120756A1公开(公告)日： 2011-05-26
- 发明人: Tsugio AMBO , Satoru Fujiwara , Yoshikatsu Hasegawa , Chihiro Nakagawa , Takeshi Ono , Atsushi Urushidani , Tooru Kashioka , Katsuji Shimazawa
- 申请人： Tsugio AMBO , Satoru Fujiwara , Yoshikatsu Hasegawa , Chihiro Nakagawa , Takeshi Ono , Atsushi Urushidani , Tooru Kashioka , Katsuji Shimazawa
- 申请人地址： JP Tokyo
- 专利权人： MITSUBISHI CABLE INDUSTRIES, LTD.
- 当前专利权人： MITSUBISHI CABLE INDUSTRIES, LTD.
- 当前专利权人地址： JP Tokyo
- 优先权： JP2004-105997 20040331; JP2004-239707 20040819; JP2004-381266 20041228
- 主分类号： H05K1/02
- IPC分类号： H05K1/02 ; H05K3/10
摘要：
A circuit board includes a foil circuit provided on a synthetic resin plate formed by injection molding, made of a copper foil, and having a pattern different for the circuit board. Anchor pins projecting upward are provided on the resin plate and passed through pinholes made in the foil circuit. The foil circuit is positioned and secured to the resin plate. In a required portion of the resin plate, a terminal insertion hole is provided, and a receiving terminal is secured to the required portion of the terminal insertion hole and connected to the foil circuit.