发明申请
US20110121463A1 SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE AND METHODS OF THE SAME
审中-公开
半导体封装，半导体器件及其相关方法
- 专利标题： SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE AND METHODS OF THE SAME
- 专利标题（中）： 半导体封装，半导体器件及其相关方法
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申请号： US12880053申请日： 2010-09-10
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公开(公告)号： US20110121463A1公开(公告)日： 2011-05-26
- 发明人: John Clarimer Vicente CONCEPCION , Takao Nogi
- 申请人： John Clarimer Vicente CONCEPCION , Takao Nogi
- 申请人地址： JP Tokyo
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JP Tokyo
- 优先权： JP2009-264648 20091120
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/58
摘要：
According to one embodiment, a semiconductor package is disclosed. The semiconductor package can include an insulative substrate having a first surface and a second surface opposed to the first surface, a first through hole formed in the insulative substrate from the first surface to the second surface, and a second through hole formed near the first through hole in the insulative substrate from the first surface to the second surface, a conductive body formed in the vicinity of the second through hole and penetrating into the insulative substrate, a first outer electrode formed on the first surface and connected to an one end of the conductive body, and a second outer electrode formed on the second surface and connected to the other end of the conductive body.
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