A circuit board assembly includes a multiple layer substrate, a wireless power transmitter control module, a wireless power coil assembly, and a plurality of ICs. The wireless power transmitter control module is supported by a layer of the multiple layer substrate and the wireless power coil assembly is fabricated on an inner layer of the multiple layer substrate. The ICs are mounted on an outer layer of the multiple layer substrate, wherein an IC of the plurality of IC is aligned to substantially overlap a coil of the wireless power coil assembly and is wirelessly powered by the wireless power transmitter control module via the coil.