Invention Application
- Patent Title: INTEGRATED CIRCUIT PACKAGE WITH MULTIPLE DIES AND INTERRUPT PROCESSING
- Patent Title (中): 集成电路包与多个DIES和中断处理
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Application No.: US12960713Application Date: 2010-12-06
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Publication No.: US20110138093A1Publication Date: 2011-06-09
- Inventor: Andrew Michael Jones , Stuart Ryan
- Applicant: Andrew Michael Jones , Stuart Ryan
- Applicant Address: GB Marlow
- Assignee: STMICROELECTRONICS (R&D) LTD
- Current Assignee: STMICROELECTRONICS (R&D) LTD
- Current Assignee Address: GB Marlow
- Priority: EP09178184.9 20091207
- Main IPC: G06F13/24
- IPC: G06F13/24 ; G06F12/00

Abstract:
A package includes a first die and a second die. The dies are connected to each other through an interface. The package includes interrupt processing for detecting interrupt information and providing a packet in response to the interrupt information detection. The packet includes an address to which data in the packet is to be written. The interface is configured to transport the packet between the dies. A data store is provided to which the data is writable. An interrupt event is determined from data received in several packets.
Public/Granted literature
- US08504751B2 Integrated circuit package with multiple dies and interrupt processing Public/Granted day:2013-08-06
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