Invention Application
US20110138093A1 INTEGRATED CIRCUIT PACKAGE WITH MULTIPLE DIES AND INTERRUPT PROCESSING 有权
集成电路包与多个DIES和中断处理

INTEGRATED CIRCUIT PACKAGE WITH MULTIPLE DIES AND INTERRUPT PROCESSING
Abstract:
A package includes a first die and a second die. The dies are connected to each other through an interface. The package includes interrupt processing for detecting interrupt information and providing a packet in response to the interrupt information detection. The packet includes an address to which data in the packet is to be written. The interface is configured to transport the packet between the dies. A data store is provided to which the data is writable. An interrupt event is determined from data received in several packets.
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