A thin electrical insulating coating and method for application is provided for a copper surface. The electrical insulating coating includes a bond coat layer of titanium, nickel, or NiCrAlY forming a metallurgical bond with the copper surface and an insulating layer of alumina or tantala applied to the bond coat layer. An insulating layer does not firmly adhere to copper under harsh environmental conditions such as an electroslag refining process when applied directly to the copper. However, when bond coat layer is applied between the copper and the insulating layer, it forms a strong bond adhering bond for the harsh environment.