Invention Application
- Patent Title: Retention Clip with Two Points of Contact
- Patent Title (中): 保持夹与两点接触
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Application No.: US12638859Application Date: 2009-12-15
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Publication No.: US20110139950A1Publication Date: 2011-06-16
- Inventor: Martin Wai , Eric Bradford , Barry Lee
- Applicant: Martin Wai , Eric Bradford , Barry Lee
- Applicant Address: US CA Santa Cruz
- Assignee: PLANTRONICS, INC.
- Current Assignee: PLANTRONICS, INC.
- Current Assignee Address: US CA Santa Cruz
- Main IPC: F16M13/00
- IPC: F16M13/00
Abstract:
A clip for holding a portable electronic device comprises a retaining structure adapted to receive and retain the portable electronic device and a clip structure coupled to the retaining structure for clipping the retaining structure to something. The clip structure applies forces at two, spaced apart locations, thereby to resist rotation of the clip in use.
Information query
