Invention Application
US20110143539A1 POLISHING PAD WITH ENDPOINT WINDOW AND SYSTEMS AND METHODS USING THE SAME
审中-公开
具有端点窗口和系统的抛光垫及其使用方法
- Patent Title: POLISHING PAD WITH ENDPOINT WINDOW AND SYSTEMS AND METHODS USING THE SAME
- Patent Title (中): 具有端点窗口和系统的抛光垫及其使用方法
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Application No.: US12991097Application Date: 2009-05-15
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Publication No.: US20110143539A1Publication Date: 2011-06-16
- Inventor: Rajeev Bajaj , Stephen Mark Fisher , William D. Joseph
- Applicant: Rajeev Bajaj , Stephen Mark Fisher , William D. Joseph
- International Application: PCT/US2009/044187 WO 20090515
- Main IPC: H01L21/306
- IPC: H01L21/306 ; B24B41/00
Abstract:
A polishing pad including a path therethrough to transmit a signal for in situ monitoring of an endpoint in a polishing operation. In one embodiment, the polishing pad includes a polishing composition distribution layer on a first side of a guide plate and a support layer on an opposed second side of a guide plate. The guide plate retains a plurality of polishing elements that extend along a first direction substantially normal to a plane including the polishing pad and through the polishing composition distribution layer. The polishing pad includes an optical path along the first direction and through a thickness of the pad.
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