Polishing pad with porous elements and method of making and using the same
    1.
    发明授权
    Polishing pad with porous elements and method of making and using the same 有权
    具有多孔元件的抛光垫及其制造和使用方法

    公开(公告)号:US08821214B2

    公开(公告)日:2014-09-02

    申请号:US13000986

    申请日:2009-06-26

    申请人: William D. Joseph

    发明人: William D. Joseph

    IPC分类号: B24B37/26 B24B37/04

    摘要: The disclosure is directed to polishing pads with porous polishing elements, and to methods of making and using such pads in a polishing process. In one exemplary embodiment, the polishing pad includes a multiplicity of polishing elements, at least some of which are porous, each polishing element affixed to a support layer so as to restrict lateral movement of the polishing elements with respect to one or more of the other polishing elements, but remaining moveable in an axis normal to a polishing surface of the polishing elements. In certain embodiments, the polishing pad may include a guide plate positioned to arrange and optionally affix the plurality of polishing elements on the support layer, and additionally, a polishing composition distribution layer. In some embodiments, the pores are distributed throughout substantially the entire porous polishing element. In other embodiments, the pores are distributed substantially at the polishing surface of the elements.

    摘要翻译: 本发明涉及具有多孔抛光元件的抛光垫,以及在抛光过程中制造和使用这种垫的方法。 在一个示例性实施例中,抛光垫包括多个抛光元件,至少其中一些抛光元件是多孔的,每个抛光元件固定在支撑层上,以便限制抛光元件相对于其它一个或多个的横向运动 抛光元件,但是可以在垂直于抛光元件的抛光表面的轴上移动。 在某些实施例中,抛光垫可以包括定位成布置并任选地将多个抛光元件固定在支撑层上的引导板,另外还包括抛光组合物分布层。 在一些实施方案中,孔分布在基本上整个多孔抛光元件的整个部分。 在其它实施例中,孔基本上分布在元件的抛光表面上。

    POLISHING PADS INCLUDING PHASE-SEPARATED POLYMER BLEND AND METHOD OF MAKING AND USING THE SAME
    2.
    发明申请
    POLISHING PADS INCLUDING PHASE-SEPARATED POLYMER BLEND AND METHOD OF MAKING AND USING THE SAME 有权
    包括相分离聚合物混合物的抛光垫及其制备和使用方法

    公开(公告)号:US20120315830A1

    公开(公告)日:2012-12-13

    申请号:US13514741

    申请日:2010-12-28

    IPC分类号: B24D11/00 B24D18/00 B24B1/00

    CPC分类号: B24B37/22 B24B37/26

    摘要: Polishing pads containing a phase-separated polymer blend, and methods of making and using such pads in a polishing process. In one exemplary embodiment, the polishing pads include a multiplicity of polishing elements integrally formed in a sheet. In another exemplary embodiment, the polishing elements are bonded to a support layer, for example by thermal bonding. In certain embodiments, the polishing pad may additionally include a compliant layer affixed to the support layer, and optionally, a polishing composition distribution layer.

    摘要翻译: 包含相分离的聚合物共混物的抛光垫,以及在抛光过程中制造和使用这种垫的方法。 在一个示例性实施例中,抛光垫包括整体形成在片材中的多个抛光元件。 在另一个示例性实施例中,抛光元件例如通过热粘合而结合到支撑层。 在某些实施例中,抛光垫可以另外包括固定到支撑层的柔顺层,以及任选的抛光组合物分布层。

    POLISHING PAD AND METHOD OF MAKING THE SAME
    4.
    发明申请
    POLISHING PAD AND METHOD OF MAKING THE SAME 审中-公开
    抛光垫及其制造方法

    公开(公告)号:US20130012108A1

    公开(公告)日:2013-01-10

    申请号:US13518475

    申请日:2010-12-20

    CPC分类号: B24D3/28 B24D3/344

    摘要: The disclosure is directed to polishing pads with porous polishing layers, methods of making such polishing pads, and methods of using such pads in a polishing process. The polishing pad includes a compliant layer having first and second opposing sides and a porous polishing layer disposed on the first side of the compliant layer. The porous polishing layer includes a crosslinked network comprising a thermally cured component and a radiation cured component, wherein the radiation cured component and the thermally cured component are covalently bonded in the crosslinked network. The porous polishing layer also includes polymer particles dispersed within the crosslinked network, wherein the polymer particles comprise at least one of thermoplastic polymers or thermoset polymers. The porous polishing layer typically also includes closed cell pores dispersed within the crosslinked network.

    摘要翻译: 本发明涉及具有多孔抛光层的抛光垫,制造这种抛光垫的方法,以及在抛光过程中使用这种垫的方法。 抛光垫包括具有第一和第二相对侧的柔顺层和设置在顺应层的第一侧上的多孔抛光层。 多孔抛光层包括包含热固化组分和辐射固化组分的交联网络,其中辐射固化组分和热固化组分共价键合在交联网络中。 多孔抛光层还包括分散在交联网络内的聚合物颗粒,其中聚合物颗粒包含热塑性聚合物或热固性聚合物中的至少一种。 多孔抛光层通常还包括分散在交联网络内的闭孔细孔。

    Polishing Pad with Floating Elements and Method of Making and Using the Same
    6.
    发明申请
    Polishing Pad with Floating Elements and Method of Making and Using the Same 审中-公开
    带漂浮元件的抛光垫及其制作及使用方法

    公开(公告)号:US20110183583A1

    公开(公告)日:2011-07-28

    申请号:US13054691

    申请日:2009-07-17

    申请人: William D. Joseph

    发明人: William D. Joseph

    IPC分类号: B24B1/00 B24D11/00 B24D13/14

    摘要: The disclosure is directed to polishing pads with floating polishing elements bonded to a support layer, for example by thermal bonding, and to methods of making and using such pads in a polishing process. In one exemplary embodiment, the polishing pad includes a multiplicity of polishing elements, at least some of which may be porous, each polishing element affixed to a major surface of a support layer so as to restrict lateral movement of the polishing elements with respect to one or more of the other polishing elements, but remaining moveable in an axis substantially normal to the support layer. In certain embodiments, the polishing pad may additionally include a compliant layer affixed to the support layer opposite the polishing elements, and optionally, a polishing composition distribution layer. In some embodiments using porous polishing elements, the pores are distributed substantially at a polishing surface of the polishing elements.

    摘要翻译: 本公开涉及具有例如通过热粘合结合到支撑层的浮动抛光元件的抛光垫,以及在抛光过程中制造和使用这种垫的方法。 在一个示例性实施例中,抛光垫包括多个抛光元件,其中至少一些抛光元件可以是多孔的,每个抛光元件固定在支撑层的主表面上,以便限制抛光元件相对于一个的横向移动 或更多的其它抛光元件,但是保持在基本垂直于支撑层的轴线上移动。 在某些实施例中,抛光垫可以另外包括固定到与抛光元件相对的支撑层的柔顺层,以及可选地,抛光组合物分布层。 在使用多孔抛光元件的一些实施例中,孔基本上分布在抛光元件的抛光表面上。

    POLISHING PAD WITH ENDPOINT WINDOW AND SYSTEMS AND METHODS USING THE SAME
    7.
    发明申请
    POLISHING PAD WITH ENDPOINT WINDOW AND SYSTEMS AND METHODS USING THE SAME 审中-公开
    具有端点窗口和系统的抛光垫及其使用方法

    公开(公告)号:US20110143539A1

    公开(公告)日:2011-06-16

    申请号:US12991097

    申请日:2009-05-15

    IPC分类号: H01L21/306 B24B41/00

    CPC分类号: B24B37/205 B24B49/12

    摘要: A polishing pad including a path therethrough to transmit a signal for in situ monitoring of an endpoint in a polishing operation. In one embodiment, the polishing pad includes a polishing composition distribution layer on a first side of a guide plate and a support layer on an opposed second side of a guide plate. The guide plate retains a plurality of polishing elements that extend along a first direction substantially normal to a plane including the polishing pad and through the polishing composition distribution layer. The polishing pad includes an optical path along the first direction and through a thickness of the pad.

    摘要翻译: 抛光垫,其包括穿过其中的通道,以在抛光操作中传输用于原位监测端点的信号。 在一个实施例中,抛光垫包括在导向板的第一侧上的抛光组合物分布层和在引导板的相对的第二侧上的支撑层。 引导板保持沿着基本上垂直于包括抛光垫的平面的第一方向延伸并穿过抛光组合物分布层的多个抛光元件。 抛光垫包括沿着第一方向并通过垫的厚度的光路。

    STRUCTURED ABRASIVE ARTICLE, METHOD OF MAKING THE SAME, AND USE IN WAFER PLANARIZATION
    8.
    发明申请
    STRUCTURED ABRASIVE ARTICLE, METHOD OF MAKING THE SAME, AND USE IN WAFER PLANARIZATION 有权
    结构化磨砂制品,其制造方法和在平面布置中的应用

    公开(公告)号:US20100056024A1

    公开(公告)日:2010-03-04

    申请号:US12539798

    申请日:2009-08-12

    IPC分类号: B24B49/12 C09K3/14 B24D3/04

    摘要: A structured abrasive article comprises an at least translucent film backing and an abrasive layer disposed on the backing. The abrasive layer comprises a plurality of shaped abrasive composites. The shaped abrasive composites comprise abrasive particles dispersed in a binder. The abrasive particles consist essentially of ceria particles having an average primary particle size of less than 100 nanometers. The binder comprises a polyether acid and a reaction product of components comprising a carboxylic(meth)acrylate and a poly(meth)acrylate, and, based on a total weight of the abrasive layer, the abrasive particles are present in an amount of at least 70 percent by weight. Methods of making and using the structured abrasive article are also disclosed.

    摘要翻译: 结构化磨料制品包括至少半透明的膜背衬和设置在背衬上的研磨层。 研磨层包括多个成形的磨料复合材料。 成形磨料复合材料包括分散在粘合剂中的磨料颗粒。 研磨颗粒主要由平均初级粒径小于100纳米的二氧化铈颗粒组成。 粘合剂包括聚醚酸和包含羧酸(甲基)丙烯酸酯和聚(甲基)丙烯酸酯的组分的反应产物,并且基于研磨层的总重量,磨料颗粒的量至少为 70重量%。 还公开了制造和使用结构化磨料制品的方法。

    Structured abrasive article, method of making the same, and use in wafer planarization
    10.
    发明授权
    Structured abrasive article, method of making the same, and use in wafer planarization 有权
    结构化磨料制品,其制造方法,并用于晶片平面化

    公开(公告)号:US08251774B2

    公开(公告)日:2012-08-28

    申请号:US12539798

    申请日:2009-08-12

    IPC分类号: B24B49/00

    摘要: A structured abrasive article comprises an at least translucent film backing and an abrasive layer disposed on the backing. The abrasive layer comprises a plurality of shaped abrasive composites. The shaped abrasive composites comprise abrasive particles dispersed in a binder. The abrasive particles consist essentially of ceria particles having an average primary particle size of less than 100 nanometers. The binder comprises a polyether acid and a reaction product of components comprising a carboxylic(meth)acrylate and a poly(meth)acrylate, and, based on a total weight of the abrasive layer, the abrasive particles are present in an amount of at least 70 percent by weight. Methods of making and using the structured abrasive article are also disclosed.

    摘要翻译: 结构化磨料制品包括至少半透明的膜背衬和设置在背衬上的研磨层。 研磨层包括多个成形的磨料复合材料。 成形磨料复合材料包括分散在粘合剂中的磨料颗粒。 研磨颗粒主要由平均初级粒径小于100纳米的二氧化铈颗粒组成。 粘合剂包括聚醚酸和包含羧酸(甲基)丙烯酸酯和聚(甲基)丙烯酸酯的组分的反应产物,并且基于研磨层的总重量,磨料颗粒的量至少为 70重量%。 还公开了制造和使用结构化磨料制品的方法。