发明申请
US20110143552A1 HEAT-RESISTANT ADHESIVE SHEET FOR SEMICONDUCTOR DEVICE FABRICATION, ADHESIVE USED FOR THE SHEET, AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SHEET
失效
用于半导体器件制造的耐热粘合片，用于片材的粘合剂，以及使用该片材制造半导体器件的方法
- 专利标题： HEAT-RESISTANT ADHESIVE SHEET FOR SEMICONDUCTOR DEVICE FABRICATION, ADHESIVE USED FOR THE SHEET, AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SHEET
- 专利标题（中）： 用于半导体器件制造的耐热粘合片，用于片材的粘合剂，以及使用该片材制造半导体器件的方法
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申请号： US12970282申请日： 2010-12-16
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公开(公告)号： US20110143552A1公开(公告)日： 2011-06-16
- 发明人: Yuichiro YANAGI , Kazuyuki KIUCHI , Shinji HOSHINO
- 申请人： Yuichiro YANAGI , Kazuyuki KIUCHI , Shinji HOSHINO
- 申请人地址： JP Osaka
- 专利权人： NITTO DENKO CORPORATION
- 当前专利权人： NITTO DENKO CORPORATION
- 当前专利权人地址： JP Osaka
- 优先权： JP2009-285570 20091216
- 主分类号： H01L21/31
- IPC分类号： H01L21/31 ; B32B7/12
摘要：
The present invention provides a heat-resistant adhesive sheet for semiconductor device fabrication that is attached to a substrateless semiconductor chip when the chip is encapsulated with resin. The adhesive sheet includes a base material layer and an adhesive layer. The adhesive layer contains a rubber component and an epoxy resin component. The proportion of the rubber component in an organic substance in the adhesive is in the range of 20 to 60 wt %.
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