公开(公告)号：US08436481B2

公开(公告)日：2013-05-07

申请号：US12974620

申请日：2010-12-21

申请人： Shinji Hoshino ,  Yukio Arimitsu ,  Kazuyuki Kiuchi ,  Akihisa Murata

发明人： Shinji Hoshino ,  Yukio Arimitsu ,  Kazuyuki Kiuchi ,  Akihisa Murata

IPC分类号： H01L23/28

CPC分类号： H01L21/568 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/96 ,  H01L2224/24137 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  Y10T428/28 ,  Y10T428/287 ,  H01L2924/00

摘要： The present invention is intended to solve the following problems with a method for fabricating a substrateless semiconductor package using an adhesive sheet as a temporary fixing supporter. A chip can be displaced from a specified position by pressure during resin encapsulation because the chip is not properly held by the adhesive sheet. If such displacement occurs, the relative positional relationship between the chip and an interconnect to be connected to a specified position in a subsequent wiring step also changes by the displacement of the chip from the specified position. Another problem is that if adhesive deposits occur during peeling of the adhesive sheet and the surface of a package is contaminated with the adhesive deposits, adhesive components left on the surface of the chip can inhibit connection between the interconnect and the chip in a subsequent wiring step. To solve these problems, the present invention provides an adhesive sheet for semiconductor device fabrication that is attached to a substrateless semiconductor chip when the chip is encapsulated with resin. The adhesive sheet includes a base material layer and an adhesive layer. The adhesive layer has a specific adhesion strength and peel strength.

摘要翻译： 本发明旨在解决使用粘合片作为临时固定支撑件制造无基底半导体封装的方法的以下问题。 由于芯片没有被粘合片正确地夹持，所以在树脂封装期间，芯片可以通过压力从指定位置移位。 如果发生这种位移，则芯片与在后续布线步骤中连接到指定位置的互连件之间的相对位置关系也随着芯片从指定位置的位移而改变。 另一个问题是如果在粘合片剥离期间发生粘合剂沉积，并且包装表面被粘合剂沉积物污染，残留在芯片表面上的粘合剂组分可以在随后的布线步骤中阻止互连和芯片之间的连接 。 为了解决这些问题，本发明提供了一种用于半导体器件制造的粘合片，其在芯片被树脂封装时附接到无基底半导体芯片。 粘合片包括基材层和粘合剂层。 粘合剂层具有特定的粘合强度和剥离强度。

公开(公告)号：US5545872A

公开(公告)日：1996-08-13

申请号：US331701

申请日：1994-10-31

申请人： Toshiharu Nakajima ,  Satoru Machimura ,  Tadashi Goto ,  Toshitaka Mochizuki ,  Shinji Hoshino ,  Hiroshi Ohtani

发明人： Toshiharu Nakajima ,  Satoru Machimura ,  Tadashi Goto ,  Toshitaka Mochizuki ,  Shinji Hoshino ,  Hiroshi Ohtani

IPC分类号： B23K11/31 ,  B23K11/36

CPC分类号： B23K11/314

摘要： An improved tip dressing process is provided wherein the pressure between the electrode tip of a resistance welder and the cutter of a tip dresser is varied during the tip dressing process. A pressure controller is also provided for controlling the pressure between the electrode tip and cutter during the tip dressing process. The pressure controller may be applied to independently control the tip dressing process of several resistance welders simultaneously.

摘要翻译： 提供改进的尖端修整过程，其中电阻焊机的电极末端与尖端修整器的切割器之间的压力在尖端修整过程期间变化。 还提供压力控制器，用于在尖端修整过程中控制电极末端和切割器之间的压力。 压力控制器可以应用于同时独立地控制几个电焊机的尖端修整过程。

公开(公告)号：US08502397B2

公开(公告)日：2013-08-06

申请号：US12970282

申请日：2010-12-16

申请人： Yuichiro Yanagi ,  Kazuyuki Kiuchi ,  Shinji Hoshino

发明人： Yuichiro Yanagi ,  Kazuyuki Kiuchi ,  Shinji Hoshino

IPC分类号： H01L23/28

CPC分类号： H01L21/568 ,  C09J7/20 ,  C09J2203/326 ,  C09J2421/00 ,  C09J2463/00 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/96 ,  H01L2224/24137 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  Y10T428/287 ,  H01L2924/00

摘要： The present invention provides a heat-resistant adhesive sheet for semiconductor device fabrication that is attached to a substrateless semiconductor chip when the chip is encapsulated with resin. The adhesive sheet includes a base material layer and an adhesive layer. The adhesive layer contains a rubber component and an epoxy resin component. The proportion of the rubber component in an organic substance in the adhesive is in the range of 20 to 60 wt %.

摘要翻译： 本发明提供了一种用于半导体器件制造的耐热粘合片，当芯片被树脂封装时，该耐热粘合片被附着到无基底半导体芯片上。 粘合片包括基材层和粘合剂层。 粘合层含有橡胶成分和环氧树脂成分。 粘合剂中的有机物质中的橡胶成分的比例为20〜60重量％。

公开(公告)号：US20110151625A1

公开(公告)日：2011-06-23

申请号：US12974620

申请日：2010-12-21

申请人： Shinji HOSHINO ,  Yukio ARIMITSU ,  Kazuyuki KIUCHI ,  Akihisa MURATA

发明人： Shinji HOSHINO ,  Yukio ARIMITSU ,  Kazuyuki KIUCHI ,  Akihisa MURATA

IPC分类号： H01L21/50 ,  B32B7/12

CPC分类号： H01L21/568 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/96 ,  H01L2224/24137 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  Y10T428/28 ,  Y10T428/287 ,  H01L2924/00

摘要： The present invention is intended to solve the following problems with a method for fabricating a substrateless semiconductor package using an adhesive sheet as a temporary fixing supporter. A chip can be displaced from a specified position by pressure during resin encapsulation because the chip is not properly held by the adhesive sheet. If such displacement occurs, the relative positional relationship between the chip and an interconnect to be connected to a specified position in a subsequent wiring step also changes by the displacement of the chip from the specified position. Another problem is that if adhesive deposits occur during peeling of the adhesive sheet and the surface of a package is contaminated with the adhesive deposits, adhesive components left on the surface of the chip can inhibit connection between the interconnect and the chip in a subsequent wiring step. To solve these problems, the present invention provides an adhesive sheet for semiconductor device fabrication that is attached to a substrateless semiconductor chip when the chip is encapsulated with resin. The adhesive sheet includes a base material layer and an adhesive layer. The adhesive layer has a specific adhesion strength and peel strength.

摘要翻译： 本发明旨在解决使用粘合片作为临时固定支撑件制造无基底半导体封装的方法的以下问题。 由于芯片没有被粘合片正确地夹持，所以在树脂封装期间，芯片可以通过压力从指定位置移位。 如果发生这种位移，则芯片与在后续布线步骤中连接到指定位置的互连件之间的相对位置关系也随着芯片从指定位置的位移而改变。 另一个问题是如果在粘合片剥离期间发生粘合剂沉积，并且包装表面被粘合剂沉积物污染，残留在芯片表面上的粘合剂组分可以在随后的布线步骤中阻止互连和芯片之间的连接 。 为了解决这些问题，本发明提供了一种用于半导体器件制造的粘合片，其在芯片被树脂封装时附接到无基底半导体芯片。 粘合片包括基材层和粘合剂层。 粘合剂层具有特定的粘合强度和剥离强度。

公开(公告)号：US20110111563A1

公开(公告)日：2011-05-12

申请号：US12944459

申请日：2010-11-11

申请人： Yuichiro YANAGI ,  Hiroyuki Kondo ,  Shinji Hoshino ,  Daisuke Shimokawa

发明人： Yuichiro YANAGI ,  Hiroyuki Kondo ,  Shinji Hoshino ,  Daisuke Shimokawa

IPC分类号： H01L21/56 ,  C09J7/02 ,  B32B33/00

CPC分类号： H01L23/3107 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/20105 ,  H01L2924/20106 ,  Y10T428/1476 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： An adhesive tape for resin-encapsulating used in a method of manufacture of a resin-encapsulated semiconductor device has a base material layer and an adhesive agent layer laminated on the base material layer, a total film thickness of the base material layer and the adhesive agent layer of 25 to 40 μm. According to the adhesive tape for resin encapsulating of the present invention, resin leakage can be efficiently prevented during the resin encapsulating operation.

摘要翻译： 用于制造树脂封装的半导体器件的方法中的用于树脂封装的胶带具有层叠在基材层上的基材层和粘合剂层，基材层和粘合剂的总膜厚度 25〜40μm。 根据本发明的树脂封装用胶带，能够在树脂封装动作中有效地防止树脂的泄漏。

公开(公告)号：US07789600B2

公开(公告)日：2010-09-07

申请号：US11989797

申请日：2006-07-26

申请人： Tadashi Goto ,  Shinji Hoshino

发明人： Tadashi Goto ,  Shinji Hoshino

IPC分类号： B23C3/00 ,  B23C5/12

CPC分类号： B23K11/3063 ,  Y10T407/1924 ,  Y10T409/304256

摘要： A tip dresser 1 dresses electrode tips 4, 5. The tip dresser 1 is rotated around a rotation axis and includes a holder 2 configured to be rotated around a rotation axis and to have concave tapers 2c, 2d, which make the rotation axis a center, on both faces of the holder 2; and a cutter 3 configured to be fixed to the holder 2 and to be protruded to sides of the electrode tips 4, 5 from the tapers 2c, 2d only at portions of the cutter 3 more inside than outer diameters D1, D2 of the electrode tips 4, 5.

摘要翻译： 尖端修整器1连接电极尖端4,5，尖端修整器1围绕旋转轴线旋转并且包括构造成围绕旋转轴线旋转并具有凹形锥形​​部分2c，2d的保持器2，其使旋转轴线成为中心 ，在保持器2的两个面上; 以及切割器3，其被配置为固定到保持器2并且仅在切割器3的比电极末端的外径D1，D2更靠内侧的部分处从锥形部2c，2d突出到电极头4,5的侧面 4，5。

公开(公告)号：US20130240141A1

公开(公告)日：2013-09-19

申请号：US13418751

申请日：2012-03-13

申请人： Kazuki SOEJIMA ,  Shinji HOSHINO ,  Takamasa HIRAYAMA ,  Kazuyuki KIUCHI

发明人： Kazuki SOEJIMA ,  Shinji HOSHINO ,  Takamasa HIRAYAMA ,  Kazuyuki KIUCHI

IPC分类号： C09J5/00

CPC分类号： H01L21/568 ,  C09J5/06 ,  C09J7/38 ,  C09J2201/134 ,  C09J2203/326 ,  C09J2205/11 ,  C09J2205/302 ,  C09J2483/00 ,  H01L21/6836 ,  H01L24/19 ,  H01L24/96 ,  H01L2221/68327 ,  H01L2224/24137 ,  H01L2924/181 ,  H01L2924/00

摘要： The present invention provides a heat-resistant pressure-sensitive adhesive tape for the production of a semiconductor device, including a base material layer and a pressure-sensitive adhesive layer formed on each side of the base material layer, in which at least the pressure-sensitive adhesive layer at a side on which a semiconductor chip is to be encapsulated with a resin contains a silicone pressure-sensitive adhesive. The heat-resistant pressure-sensitive adhesive tape is used for temporarily fixing a chip in a method for producing a substrateless semiconductor package which does not use a metal lead frame.

摘要翻译： 本发明提供一种用于制造半导体器件的耐热粘合带，其包括在基材层的每一侧上形成的基材层和压敏粘合剂层，其中， 在其上用树脂封装半导体芯片的一侧的粘合剂层包含硅氧烷压敏粘合剂。 耐热粘合带用于在不使用金属引线框架的无基板半导体封装的制造方法中临时固定芯片。

公开(公告)号：US20130020031A1

公开(公告)日：2013-01-24

申请号：US13552937

申请日：2012-07-19

申请人： Masato FUJITA ,  Shinji Hoshino ,  Takahiro Nonaka

发明人： Masato FUJITA ,  Shinji Hoshino ,  Takahiro Nonaka

IPC分类号： B32B38/10

CPC分类号： B32B43/006 ,  B32B2457/20 ,  Y10T156/11 ,  Y10T156/1153 ,  Y10T156/19 ,  Y10T156/1961

摘要： A workpiece composed of a glass plate and a display panel joined to each other via an adhesive sheet is suction-held on both surfaces thereof by a pair of upper and lower holding members. The glass plate is detached from the display panel through swinging downward one end of the lower holding member around a support shaft provided on the other end side thereof with an entire surface of the glass plate being held in a planar state with a suction surface of the lower holding member.

摘要翻译： 由玻璃板和通过粘合片彼此接合的显示面板构成的工件通过一对上下保持构件在其两面被吸引保持。 玻璃板通过向下摆动的下保持构件的一端围绕设置在其另一端侧的支撑轴向下摆动，玻璃板的整个表面被保持在平面状态，其吸力表面为 下保持构件。

公开(公告)号：US20110143552A1

公开(公告)日：2011-06-16

申请号：US12970282

申请日：2010-12-16

申请人： Yuichiro YANAGI ,  Kazuyuki KIUCHI ,  Shinji HOSHINO

发明人： Yuichiro YANAGI ,  Kazuyuki KIUCHI ,  Shinji HOSHINO

IPC分类号： H01L21/31 ,  B32B7/12

CPC分类号： H01L21/568 ,  C09J7/20 ,  C09J2203/326 ,  C09J2421/00 ,  C09J2463/00 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/96 ,  H01L2224/24137 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  Y10T428/287 ,  H01L2924/00

摘要： The present invention provides a heat-resistant adhesive sheet for semiconductor device fabrication that is attached to a substrateless semiconductor chip when the chip is encapsulated with resin. The adhesive sheet includes a base material layer and an adhesive layer. The adhesive layer contains a rubber component and an epoxy resin component. The proportion of the rubber component in an organic substance in the adhesive is in the range of 20 to 60 wt %.

摘要翻译： 本发明提供了一种用于半导体器件制造的耐热粘合片，当芯片被树脂封装时，该耐热粘合片被附着到无基底半导体芯片上。 粘合片包括基材层和粘合剂层。 粘合层含有橡胶成分和环氧树脂成分。 粘合剂中的有机物质中的橡胶成分的比例为20〜60重量％。

公开(公告)号：US20130237017A1

公开(公告)日：2013-09-12

申请号：US13415217

申请日：2012-03-08

申请人： Hiroyuki KONDO ,  Shinji HOSHINO ,  Yukio ARIMITSU ,  Akinori NISHIO

发明人： Hiroyuki KONDO ,  Shinji HOSHINO ,  Yukio ARIMITSU ,  Akinori NISHIO

IPC分类号： H01L21/50 ,  B32B5/00 ,  B32B33/00 ,  B32B7/02 ,  C09J143/04 ,  C09J133/08 ,  C09J7/02 ,  C09J121/00

CPC分类号： B32B7/02 ,  B32B7/06 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  B32B27/281 ,  B32B27/286 ,  B32B27/288 ,  B32B27/304 ,  B32B27/32 ,  B32B27/36 ,  B32B27/40 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2307/51 ,  B32B2307/748 ,  B32B2405/00 ,  C09J7/22 ,  C09J133/02 ,  C09J133/08 ,  C09J2201/606 ,  C09J2201/622 ,  C09J2203/326 ,  H01L21/568 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/78251 ,  H01L2224/78744 ,  H01L2224/83001 ,  H01L2224/83862 ,  H01L2224/85001 ,  H01L2224/85207 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  Y10T428/1476 ,  Y10T428/2495 ,  Y10T428/264 ,  Y10T428/266 ,  Y10T428/28 ,  Y10T428/2852 ,  Y10T428/2891 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/20752 ,  H01L2924/00 ,  C08F2220/1825 ,  C08F220/06

摘要： The present invention provides a pressure-sensitive adhesive tape for resin encapsulation in production of a resin encapsulation type semiconductor device, which includes a base material layer which does not have a glass transition temperature in a temperature region of 260° C. or lower and a pressure-sensitive adhesive layer laminated on the base material layer, and a method for producing a resin encapsulation type semiconductor device using the pressure-sensitive adhesive tape. The pressure-sensitive adhesive tape according to the present invention highly prevents resin leakage even under severe conditions as in MAP-QFN production process, does not affect certainty of wire bonding and has excellent peelability after resin encapsulation.

摘要翻译： 本发明提供一种树脂封装型半导体装置的制造中的树脂封装用粘合带，该粘合带包括在260℃以下的温度区域中不具有玻璃化转变温度的基材层， 层压在基材层上的压敏粘合层，以及使用该粘合带的树脂封装型半导体装置的制造方法。 根据本发明的压敏粘合带，即使在MAP-QFN制造工艺中的严酷条件下也能够很好地防止树脂的渗漏，不影响引线接合的确定性，并且在树脂封装后具有优异的剥离性。