发明申请
- 专利标题： PRINTED WIRING BOARD
- 专利标题（中）： 印刷线路板
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申请号： US13059497申请日： 2009-08-18
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公开(公告)号： US20110147053A1公开(公告)日： 2011-06-23
- 发明人: Toshiyuki Kawaguchi , Kazutoki Tahara , Tsutomu Saga
- 申请人： Toshiyuki Kawaguchi , Kazutoki Tahara , Tsutomu Saga
- 申请人地址： JP Tokyo
- 专利权人： Shin-Etsu Polymer Co., Ltd.
- 当前专利权人： Shin-Etsu Polymer Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 优先权： JP2008-211100 20080819
- 国际申请： PCT/JP2009/064463 WO 20090818
- 主分类号： H05K1/00
- IPC分类号： H05K1/00
摘要：
A printed wiring board is formed by adhering a coverlay film having a resistance layer formed on a surface of the coverlay film body to a printed wiring board body having a conductive layer formed on a surface of a substrate through an adhesive layer. The resistance layer is separated from and opposed to the conductive layer through the adhesive layer.
公开/授权文献
- US08507801B2 Printed wiring board 公开/授权日：2013-08-13
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