发明申请
- 专利标题： PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- 专利标题（中）： 印刷线路板和制造印刷线路板的方法
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申请号： US12915582申请日： 2010-10-29
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公开(公告)号： US20110147057A1公开(公告)日： 2011-06-23
- 发明人: Masaru Takada , Fusaji Nagaya , Takao Okada , Tomohiko Murata
- 申请人： Masaru Takada , Fusaji Nagaya , Takao Okada , Tomohiko Murata
- 申请人地址： JP Ogaki-shi
- 专利权人： IBIDEN CO., LTD.
- 当前专利权人： IBIDEN CO., LTD.
- 当前专利权人地址： JP Ogaki-shi
- 主分类号： H05K1/09
- IPC分类号： H05K1/09 ; H05K1/02 ; H05K3/00
摘要：
A method for manufacturing a printed wiring board includes forming a pad for mounting an electronic component on a resin layer, forming a solder-resist layer on the resin layer and the pad, exposing an upper surface of the pad and a portion of a side wall of the pad from the solder-resist layer, and forming a metal layer on the upper surface of the pad and the portion of the side wall of the pad.
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