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发明申请
US20110147867A1 METHOD OF VERTICALLY MOUNTING AN INTEGRATED CIRCUIT 审中-公开
垂直安装集成电路的方法

METHOD OF VERTICALLY MOUNTING AN INTEGRATED CIRCUIT
摘要：
A method of mounting a first integrated circuit (102, 500, 704) on one of a circuit board (300, 700) or a second integrated circuit (706), the first integrated circuit (102, 500, 704) formed over a substrate (104) and having a surface (119) opposed to the substrate (104) and a side (122, 530, 930) substantially orthogonal to the surface (119), and including a conductive element (116, 117, 118, 522, 524, 526, 528, 528′, 528″) coupled to circuitry (102, 500, 704) and formed within a dielectric material (120, 518), the one of the circuit board (300, 700) or the second integrated circuit (706) including a contact point (304, 306, 314), the method including singulating (1104) the first integrated circuit (102, 500, 704) to expose the conductive element (116, 117, 118, 522, 524, 526, 528, 528′, 528″) on the side (222, 630, 1030), and mounting (1108) the first integrated circuit (102, 500, 704) on the one of a circuit board (300, 700) or a second integrated circuit (706) by aligning the conductive element (116, 117, 118, 522, 524, 526, 528, 528′, 528″) exposed on the side (222, 630, 1030) to make electrical contact with the contact point (304, 306, 314).
摘要（中）：

一种将第一集成电路（102,500,704）安装在电路板（300,700）或第二集成电路（706）之一上的方法，所述第一集成电路（102,500,704）形成在衬底 （104），并且具有与所述基板（104）相对的表面（119）和与所述表面（119）基本正交的侧面（122,530,930），并且包括导电元件（116,117,118,522） 耦合到电路（102,500,704）并且形成在介电材料（120,518）内的电路板（300,700）或第二集成电路（120,518）中的一个 （706）包括接触点（304,306,314），所述方法包括对所述第一集成电路（102,500,604）进行单独（1104）以暴露所述导电元件（116,117，118,522,524,526） ，528,582'，528“），并且将第一集成电路（102,500,604）安装（1108）在电路板（300,700）或 第二集成电路（706） 导电元件（116,117,118,522,524,526,528,528'，528“）暴露在侧面（222,630,1030）上以与接触点（304,306,314）电接触， 。

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